Phased Array Plasma Source for Uniform Moving-Substrate Coverage
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Solution Overview
Problem
Spatial plasma enhanced atomic layer deposition methods often result in charge-related damage to sensitive devices due to partial exposure of substrates to plasma, leading to incomplete exposure and potential damage during the deposition process.
Innovation Solution
A processing chamber with a gas distribution assembly and a susceptor assembly that includes an array of individual plasma sources, where a controller monitors the substrate's position and powers or disables the plasma sources to ensure the entire substrate is exposed to plasma simultaneously, preventing charge buildup and damage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If the substrate moves through a plasma zone with only partial exposure, then productivity is improved, but charge-related damage occurs to sensitive devices
Solution Approach 1:
The plasma source is divided into multiple independently controllable plasma elements arranged in an array. Each plasma element can be individually powered or disabled based on the substrate position, allowing selective plasma exposure across different zones of the substrate simultaneously. This segmentation enables the entire substrate to be exposed to plasma at the same time while maintaining high productivity through continuous substrate movement.
2Reliability
If the entire substrate is exposed to plasma simultaneously, then charge-related damage is prevented, but device complexity increases due to array of plasma sources
Solution Approach 1:
The system dynamically adjusts plasma source activation based on real-time substrate position monitoring. The controller receives position feedback and dynamically powers or disables individual plasma elements in the array to maintain optimal plasma coverage as the substrate moves through the processing zone. This dynamic control ensures uniform plasma exposure across the entire substrate while managing system complexity through automated position-based control.
Solution Approach 2:
A controller monitors the substrate position and uses this feedback to determine which plasma elements should be active at any given moment. The position information feeds back to the controller, which adjusts the plasma source configuration accordingly, ensuring that the entire substrate receives plasma exposure simultaneously while maintaining precise control over the plasma zone configuration.
3Manufacturing precision
If individual plasma sources are powered selectively based on substrate position, then uniform plasma coverage is achieved, but energy consumption increases
Solution Approach 1:
Instead of powering all plasma elements uniformly, the system applies plasma only to the specific zones where substrate exposure is needed at any given moment. Individual plasma elements are selectively activated based on their spatial relationship to the substrate position, creating localized plasma regions that match the substrate coverage requirements. This local quality approach reduces overall energy consumption while maintaining uniform plasma coverage across the substrate surface.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution ensures uniform plasma exposure to the substrate, reducing charge-related damage and enhancing the deposition process by maintaining consistent plasma coverage throughout the substrate's movement within the plasma zone.
Implementation Method 1
a plasma process region with an array of individual plasma sources
Data Source
AI summary
Apparatus and methods to process a substrate comprising a gas distribution assembly comprising a plasma process region with an array of individual plasma sources. A controller is connected to the array of individual plasma sources and the substrate support. The controller is configured monitor the position of the at least one substrate and provide or disable power to the individual plasma sources based on the position of the substrate relative to the individual plasma sources.