Phased-Array Plasma Processing for Substrate Curvature Relief
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Solution Overview
Problem
In plasma processing for 3D NAND, the curvature of substrates leads to pattern deviations during exposure due to stress, which existing methods struggle to effectively alleviate by uniformly controlling plasma distribution across the substrate surfaces.
Innovation Solution
A plasma processing apparatus with phased array antennas that control the phase of microwaves to concentrate plasma distribution, allowing for precise film formation on the rear surface of substrates, thereby relieving stress and flattening the substrate by locally generating plasma and adjusting electric field strengths.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Shape
If a film is formed on the rear surface of the substrate to relieve stress, then substrate flatness is improved, but plasma distribution uniformity deteriorates
Solution Approach 1:
The patent applies local quality by using phased array antennas to create non-uniform plasma distribution specifically targeted at the rear surface of the substrate. The system adjusts phase and amplitude of electromagnetic waves to generate higher plasma density at the rear surface compared to the front surface, enabling selective stress relief without compromising front surface film uniformity. This resolves the contradiction by making plasma distribution spatially varying rather than uniform.
Solution Approach 2:
The patent segments the plasma processing into distinct regions by using multiple phased array antennas that can be independently controlled. Each antenna element can be adjusted to contribute differently to the overall plasma distribution, allowing the system to create specific plasma density patterns at different locations on the substrate, particularly enhancing plasma concentration at the rear surface while maintaining front surface quality.
2Shape
If plasma distribution is concentrated on the rear surface to relieve stress, then substrate flatness is improved, but plasma distribution uniformity across the substrate deteriorates
Solution Approach 1:
The system implements local quality by creating spatially varying plasma distribution through phased array antenna control. By adjusting the phase and amplitude of electromagnetic waves from different antenna elements, the system concentrates plasma density at the rear surface where stress relief is needed, while maintaining appropriate plasma levels at the front surface. This targeted approach improves substrate flatness without requiring uniform plasma distribution across the entire substrate.
Solution Approach 2:
The patent applies dynamics by enabling real-time adjustment of plasma distribution through phase and amplitude modulation of electromagnetic waves from the phased array antennas. The system can dynamically change the plasma density pattern during processing, allowing optimization of stress relief at the rear surface while maintaining front surface film quality, thus resolving the contradiction between localized stress relief and overall uniformity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables advanced control of plasma distribution, ensuring uniform film formation and stress relief on substrates, effectively addressing curvature issues and improving pattern accuracy during the exposure process.
Implementation Method 1
a plurality of phased array antennas disposed below the dielectric window and configured to irradiate a plurality of electromagnetic waves
Implementation Method 2
concentrate plasma distribution, allowing for precise film formation on the rear surface of substrates
Implementation Method 3
a dielectric window disposed below the substrate holder
Implementation Method 4
allowing for precise film formation on the rear surface of substrates
Data Source
AI summary
A plasma processing apparatus includes: a processing container; a substrate holder disposed within the processing container and configured to hold a substrate thereon; a dielectric window disposed below the substrate holder; and a plurality of phased array antennas disposed below the dielectric window and configured to irradiate a plurality of electromagnetic waves.