Phased-Array Antenna Sub-Array Layout for Simpler RF Routing
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Solution Overview
Problem
Existing phased-array antenna systems face challenges in reducing routing complexity and size at higher frequencies, particularly in millimeter wave frequencies, due to the limitations of surface mount devices (SMD) resistors and parasitics, which affect performance and cost.
Innovation Solution
The integration of a combiner-splitter and multi-channel up-down converter (UDC) as an integrated device between beamformer devices on a substrate, reducing routing complexity and maintaining separate UDC and beamformer devices for optimal performance, using a distributed architecture.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If traditional surface mount devices (SMD) resistors are used to implement combiner-splitters and up-down converters, then the system can be manufactured using conventional techniques, but the routing complexity increases and component size becomes large at higher frequencies
Solution Approach 1:
The patent integrates the combiner-splitter and up-down converter functions directly into the beamformer device architecture, merging previously separate components (SMD resistors, combiner-splitter network, UDC) into a unified integrated circuit. This consolidation eliminates complex external routing while maintaining conventional manufacturing compatibility, directly resolving the contradiction between ease of manufacture and device complexity.
2Ease of manufacture
If traditional SMD resistor-based combiner-splitters are used, then the system can be assembled using standard components, but the antenna panel size increases
Solution Approach 1:
The integration of combiner-splitter and UDC functions into the beamformer device eliminates the need for separate SMD resistor assemblies and external combiner networks. This merging of functions into a single integrated circuit dramatically reduces the physical footprint on the antenna panel while maintaining compatibility with standard assembly processes.
3Ease of manufacture
If SMD resistors are used in combiner-splitters, then the system can be built with off-the-shelf components, but high-frequency operation is limited
Solution Approach 1:
The patent replaces the mechanical/electrical system of discrete SMD resistors and external combiner networks with an integrated circuit implementation. This substitution eliminates the parasitic effects and connection losses inherent in discrete component assemblies, enabling reliable high-frequency operation while maintaining ease of manufacture through standardized integrated circuit fabrication processes.
Data Source
AI summary
A phased-array antenna system includes a substrate and a plurality of sub-arrays. Each sub-array comprises an array of patch antennas arranged on a first major surface of the substrate; a plurality of beamformer devices coupled to the array of patch antennas; a multi-channel up-down converter (UDC) and a combiner-splitter coupled to the multi-channel UDC. The combiner-splitter is configured to split a signal provided by the UDC and provide the signal to each of the plurality of beamformers and/or to combine signal provided by the plurality of beamformers and to provide the combined signal to the UDC. Each sub-array also includes an integrated device comprising the multi-channel UDC and the combiner-splitter. The integrated device and the plurality of beamformer devices is arranged on a second major surface of the substrate opposite the first major surface. The integrated device is arranged between at least two beamformer devices.