Phased Array Antenna Slot-Wall Structure for Low Side Radiation
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Solution Overview
Problem
Existing array antennas in electronic devices face issues such as increased interference, unnecessary side radiation, decreased antenna efficiency, and narrow operating bandwidth due to reduced spacing between antenna elements, particularly in the millimeter wave band, which affects directivity and broadband service provision.
Innovation Solution
A phased array antenna structure is implemented on a dielectric substrate with a multi-layered conductive layer configuration, including conductive vias and dummy patterns, to form a slot wall structure that enhances antenna efficiency and directivity by reducing side radiation and improving gain flatness across the frequency band.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If antenna elements are arranged adjacent to each other at a certain gap or less for beamforming, then beamforming capability is improved, but interference between antenna elements increases
Solution Approach 1:
The patent transitions from a planar two-dimensional antenna element design to a three-dimensional stacked structure with multiple conductive layers. This dimensional change allows antenna elements to be arranged in vertical stacks rather than just horizontal arrays, enabling beamforming while reducing lateral interference between elements through the third dimension.
Solution Approach 2:
The antenna element is segmented into multiple conductive layers (first conductive layer, second conductive layer, third conductive layer) separated by dielectric substrates. Each layer contains specific conductive patterns ( openings, traces) that work together to achieve beamforming while the segmentation reduces mutual interference by spatially separating current paths.
2Ease of manufacture
If a planar antenna element structure is used, then manufacturing simplicity is maintained, but operating bandwidth is narrow
Solution Approach 1:
The patent extends the planar antenna design into the third dimension by stacking multiple conductive layers at different heights. This stacked configuration increases the effective electrical length and resonant modes of the antenna, thereby expanding the operating bandwidth while maintaining compatibility with standard PCB manufacturing processes.
Solution Approach 2:
The antenna employs a composite structure combining multiple dielectric materials (dielectric substrate, dielectric cover layer) with conductive materials (conductive layers, conductive traces). This composite construction allows optimization of electromagnetic properties for broadband operation while using conventional manufacturing techniques.
3Area of stationary object
If antenna elements are placed close together, then array compactness is improved, but side radiation components increase and antenna efficiency decreases
Solution Approach 1:
By stacking conductive layers vertically, the patent achieves compact horizontal footprint while directing radiation primarily in the horizontal plane. The vertical stacking confines surface waves and reduces unwanted vertical radiation, improving efficiency while maintaining compactness.
Solution Approach 2:
Dielectric substrates and cover layers act as intermediaries between conductive layers, controlling electromagnetic field distribution. These dielectric materials guide surface waves and reduce side radiation by providing controlled impedance paths, thereby improving antenna efficiency in compact configurations.
Data Source
AI summary
An antenna module of an electronic device is implemented as a phased array antenna implemented on a dielectric cover substrate. The dielectric substrate may comprise: a first layer having a first conductive layer including a first opening and a second opening on a surface of the dielectric substrate; a second layer having a second conductive layer including a fourth opening and a fifth opening in the dielectric substrate; and a third layer having a third conductive layer including a third opening in the dielectric substrate. The antenna module may comprise: a dielectric cover layer; and a dielectric substrate having a surface mounted facing the dielectric cover layer.