Phased Array Transducer Wafer-Scale Layout for Batch Manufacturing
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Solution Overview
Problem
Conventional phased array transducer manufacturing is limited by the need for individual handling and assembly, making batch processing difficult due to design constraints like wrap-around electrodes, resulting in small production lots and inconsistent results across multiple tool sets.
Innovation Solution
The use of wafer scale manufacturing to produce a grid of phased array transducers with ground contact traces on a piezoelectric layer, allowing for additive manufacturing and electrical trace routing on a carrier block to enable electrical isolation and connection between transducer elements, eliminating the need for adhesive layers and facilitating high-volume, low-cost production.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If wrap-around electrodes are used on piezoelectric layers, then ground connections are achieved, but manufacturing is limited to individual processing and batch production is difficult
Solution Approach 1:
The patent divides the ground connection structure into discrete ground contact traces on the piezoelectric layer that can be individually addressed and connected to separate ground pads on the carrier block. This segmentation allows each transducer element to have its own ground path, enabling batch processing while maintaining reliable ground connections for each element.
Solution Approach 2:
The patent transitions from wrap-around electrodes that require lateral routing around the piezoelectric layer edges to a vertical/direct connection architecture where ground contact traces extend from the piezoelectric layer surface directly to the carrier block. This dimensional change eliminates the wrap-around constraint and enables systematic batch fabrication.
2Manufacturing precision
If individual handling and assembly is used for each transducer component, then precise assembly is achieved, but production capacity is limited and costs increase
Solution Approach 1:
The patent merges multiple transducer elements onto a single carrier block in a grid array configuration. Multiple piezoelectric layers with their respective ground contact traces are assembled together on the same carrier, allowing simultaneous processing and testing of many elements. This merging dramatically increases production capacity while maintaining assembly precision through the carrier's structural guidance.
Solution Approach 2:
The carrier block serves multiple functions: it provides mechanical support, electrical grounding through ground pads, acoustic backing, and a platform for batch assembly of multiple transducer elements. This multi-functionality eliminates the need for separate handling and assembly fixtures for each element, thereby increasing productivity while maintaining precision.
3Adaptability or versatility
If small production lots are used with multiple tool sets, then design constraints are met, but consistency across tools becomes difficult to maintain
Solution Approach 1:
The carrier block is designed as a universal platform that can accommodate and process multiple transducer elements simultaneously using the same tool set. This universal carrier design eliminates the need for multiple specialized tool sets, ensuring consistent processing conditions and results across all elements while still meeting specific design constraints through configurable trace patterns and element layouts.
4Reliability
If 2×N grid configuration is used with wrap-around electrodes, then ground connections are achieved, but array size is limited
Solution Approach 1:
The patent segments the ground connection into multiple independent ground contact traces that can be distributed across the entire piezoelectric layer surface. This segmentation allows ground connections to be made at multiple locations rather than requiring wrap-around paths, enabling expansion to larger M×N grid configurations beyond the limited 2×N arrangement.
Solution Approach 2:
The patent changes from lateral wrap-around ground paths to vertical/direct ground contact traces that extend from the piezoelectric layer to the carrier block. This dimensional change frees the design from the 2×N grid constraint, allowing arbitrary M×N array configurations where ground connections are made directly beneath each element rather than around the perimeter.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method enables the bulk manufacture of phased array transducers with enhanced control over dimensions and reduced costs, allowing for larger arrays and increased production capacity while maintaining acoustic performance.
Implementation Method 1
individual layers of a piezoelectric material... for medical transducers operating between 1 to 20 MHz
Implementation Method 2
one or more acoustic matching and/or de-matching materials... plurality of acoustic matching layers is disposed on the first side of the piezoelectric layer
Implementation Method 3
acoustic backing structure disposed on the second side of the piezoelectric layer, where the acoustic backing structure is operatively coupled to the plurality of transducer elements
Data Source
AI summary
A grid of phased array transducers includes a piezoelectric layer and a plurality of ground contact traces. The piezoelectric layer includes a first side and a second side. The plurality of ground contact traces is disposed on the first side of the piezoelectric layer along an elevational direction, where each ground contact trace of the plurality of ground contact traces extends along an azimuthal direction. Further, each phased array transducer of the grid of phased array transducers is disposed between an adjacently disposed pair of ground contact traces of the plurality of ground contact traces. Moreover, each phased array transducer includes at least a portion of at least one ground contact trace of a corresponding pair of ground contact traces, and where each phased array transducer includes a plurality of transducer elements.