Phenol Resin Separation Layer for Semiconductor Package Substrate
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Solution Overview
Problem
The separability of a support base from a laminate is problematic when attempting miniaturization of semiconductor packages, as the reduced thickness of substrates leads to decreased strength and potential damage during manufacturing, and existing methods do not effectively address this issue.
Innovation Solution
A composition for forming a separation layer with a resin component having a phenol skeleton is used, which is applied between a support base and a substrate, allowing the support base to be separated by light irradiation, thereby improving the photoreactivity and separability of the support base from the laminate.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the thickness of substrate is reduced to achieve miniaturization of semiconductor package, then the size of semiconductor package is reduced, but the strength of substrate is decreased and damage is likely to occur
Solution Approach 1:
The invention divides the support structure into two parts: a support base for providing strength and a substrate for containing the semiconductor element. By separating these functions, the substrate can be made thin for miniaturization while the support base maintains the required strength to prevent damage during manufacturing.
Solution Approach 2:
The invention introduces a separation layer as an intermediary between the support base and substrate. This layer enables temporary bonding during manufacturing to maintain strength, then allows easy separation afterward. The separation layer acts as a mediator that provides both bonding and release functions, resolving the contradiction between needing strength and needing thin substrate.
2Strength
If a laminate is formed by bonding support base to substrate to maintain strength, then the strength is improved, but the separability of support base from laminate becomes problematic
Solution Approach 1:
The separation layer serves as an intermediary that provides temporary bonding between support base and substrate during manufacturing, then enables easy separation when needed. Its unique properties allow it to function both as an adhesive and a release layer, resolving the contradiction between maintaining strength and enabling separability.
Solution Approach 2:
The separation layer's properties change in response to light irradiation. When irradiated, the separation layer undergoes chemical changes that reduce its adhesion, enabling easy separation. This parameter change allows the same layer to provide both strong bonding during manufacturing and easy separation afterward.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The increased photoreactivity of the separation layer enables effective separation of the support base from the laminate, enhancing the chemical resistance and preventing damage during the manufacturing process of semiconductor packages.
Implementation Method 1
irradiating the separation layer with radiant energy (light) from the support base side so that the separation layer is modified and decomposed to separate the processed substrate and the support base from each other
Implementation Method 2
the separation layer is modifiable by irradiation of light from the support base side of the laminate, so as to render the support base separable from the laminate
Data Source
AI summary
A composition for forming a separation layer that separates a support base that transmits light from a laminate including the support base, a substrate, the separation layer and an adhesive layer between the support base and the substrate by irradiating the separation layer with light from the support base side and modifying the separation layer. The composition contains a resin component which has a phenol skeleton.