Phenolic Foam Laminate Board Wrinkle Prevention
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Solution Overview
Problem
HCFO-1224yd (Z) has low solubility and high volume per substance amount in resol-type phenolic resins, making it difficult to disperse uniformly, leading to insufficient cell internal pressure and increased likelihood of wrinkles on the surface material of phenolic resin foam laminate boards.
Innovation Solution
A phenolic resin foam laminate board with a density of 22-50 kg/m3, cell diameter of 50-170 μm, and closed cell ratio of 80% or more, where HCFO-1224yd (Z) is the sole gas component, and the cell internal pressure is maintained at 0.20 atm or more.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of energy
If HCFO-1224yd (Z) is used as a blowing agent to reduce thermal conductivity, then heat insulation performance is improved, but dispersion uniformity deteriorates due to low solubility and large volume per substance amount
Solution Approach 1:
The patent changes the physical and chemical parameters of the phenolic resin system, including using specific resin compositions and adjusting processing conditions, to improve the solubility and dispersion of HCFO-1224yd (Z) blowing agent, thereby achieving both low thermal conductivity and uniform dispersion
Solution Approach 2:
The patent employs composite material strategies by combining HCFO-1224yd (Z) with other blowing agents or modifying the phenolic resin composition to create a multi-component system that achieves both low thermal conductivity and improved dispersion uniformity
2Loss of energy
If HCFO-1224yd (Z) is used as a blowing agent to reduce thermal conductivity, then heat insulation performance is improved, but cell internal pressure decreases leading to shrinkage
Solution Approach 1:
The patent adjusts processing parameters such as curing temperature, pressure, and time to compensate for the lower cell internal pressure generated by HCFO-1224yd (Z), preventing shrinkage while maintaining the low thermal conductivity benefit
Solution Approach 2:
The patent introduces intermediary substances or modifiers that enhance the pressure-generating capability of HCFO-1224yd (Z) during foaming, or that strengthen the foam structure to resist shrinkage, thereby maintaining both low thermal conductivity and sufficient cell internal pressure
3Loss of energy
If HCFO-1224yd (Z) is used as a blowing agent, then thermal insulation is improved, but wrinkles occur on the surface material
Solution Approach 1:
The patent optimizes processing parameters including curing temperature profile, pressure conditions, and foaming rate to prevent surface material wrinkling while utilizing HCFO-1224yd (Z) for low thermal conductivity
Solution Approach 2:
The patent applies preliminary actions such as pre-heating, pre-pressing, or surface treatment of the laminate board before final curing to prevent wrinkles from forming during the foaming process, enabling the use of HCFO-1224yd (Z) without surface defects
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution achieves high heat insulation performance, reduces wrinkles on the surface material, and enhances the smoothness of the phenolic resin foam laminate board.
Implementation Method 1
phenolic resin foam has high heat insulation properties... using HCFO-1224yd (Z), which has particularly low thermal conductivity as a blowing agent
Implementation Method 2
phenolic resin foam has high heat insulation properties... thermal conductivity can be reduced by using HCFO-1224yd (Z)
Data Source
AI summary
In the phenolic resin foam laminate board (10), a surface material (2) is arranged on at least one of one side of a phenolic resin foam (1) and the back side of the one side. The phenolic resin foam (1) has a density of not less than 22 kg/m3 and not more than 50 kg/m3, a cell diameter of not less than 50 μm and not more than 170 μm, and a closed cell ratio of not less than 80%. When HCFO-1224yd(Z), aliphatic hydrocarbons having a carbon number of 6 or less, chlorinated saturated hydrocarbons having a carbon number of 5 or less, and hydrofluoroolefin are gas components, the phenolic resin foam contains only HCFO-1224yd (Z) as a gas component. A cell internal pressure of air bubble is 0.20 atm or more.