Phenolic Resin Composition for Semiconductor Films
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Solution Overview
Problem
Conventional phenolic resin compositions used for semiconductor devices as surface protective films or interlayer insulating films have low elongation and reliability when thermally cured at 250°C or lower, making them unsuitable alternatives to polyimide and polybenzoxazole resins.
Innovation Solution
A photopolymer composition comprising a phenolic resin with a biphenyldiyl structure, a photo acid-generating agent, and a compound reactive with the phenolic resin, which is cured at 250°C or lower to achieve high elongation and reliability, including a specific manufacturing method involving spin-coating, exposure to actinic light, and thermal treatment.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If conventional phenolic resin compositions are used for surface protective films or interlayer insulating films in semiconductor devices, then thermal curing at 250°C or lower is achieved, but elongation and reliability are insufficient
Solution Approach 1:
The patent uses a composite system consisting of phenolic resin (A) with specific molecular weight (1,500-35,000), crosslinking agent (B) in controlled amounts (1-30 parts by mass per 100 parts of resin A), and optional modifier (C) such as polyhydric alcohol or carboxylic acid. This composite approach allows the film to achieve both low-curing-temperature capability and high reliability/elongation properties that individual components cannot provide alone.
Solution Approach 2:
The patent optimizes specific parameters including the molecular weight range of phenolic resin A (1,500-35,000), the stoichiometric ratio of crosslinking agent B (1-30 parts by mass per 100 parts of resin A), and the structural characteristics of the phenolic resin (condensation product of phenol and formaldehyde with specific molecular weight distribution). These parameter optimizations enable the material to cure at 250°C or lower while achieving elongation of 5% or more and reliability comparable to polyimide and polybenzoxazole resins.
2Ease of manufacture
If phenolic resin is used as alternative to polyimide and polybenzoxazole resins, then cost performance is improved, but mechanical properties and reliability are insufficient
Solution Approach 1:
The patent optimizes the molecular weight of phenolic resin A to be in the range of 1,500-35,000, which balances processability and mechanical properties. The controlled molecular weight ensures adequate viscosity for coating while providing sufficient chain length for mechanical strength. Additionally, the specific crosslinking density achieved through the optimized ratio of crosslinking agent B provides the necessary mechanical reinforcement to match polyimide and polybenzoxazole resins.
Solution Approach 2:
The patent creates a composite system where phenolic resin A is combined with crosslinking agent B and optionally modifier C. This composite structure provides mechanical reinforcement through crosslinking networks while maintaining the cost advantages of phenolic resin. The synergistic interaction between components delivers mechanical properties and reliability comparable to expensive polyimide and polybenzoxazole resins.
3Reliability
If crosslinking density is increased to improve reliability, then film strength is improved, but elongation decreases
Solution Approach 1:
The patent optimizes the crosslinking agent B content to be in the specific range of 1-30 parts by mass per 100 parts of phenolic resin A. This controlled crosslinking density achieves the optimal balance: sufficient crosslinks to provide reliability and mechanical strength, but not so many as to eliminate chain mobility and elongation. The phenolic resin's molecular weight range (1,500-35,000) also contributes by providing adequate chain length between crosslink points to maintain elongation capability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enables the production of semiconductor devices with highly reliable surface protective and interlayer insulating films that exhibit improved mechanical properties and reduced cracking, enhancing the overall reliability of semiconductor devices.
Implementation Method 1
a photopolymer composition comprising a phenolic resin with a biphenyldiyl structure, a photo acid-generating agent, and a compound reactive with the phenolic resin, which is cured at 250°C or lower
Implementation Method 2
thermal curing for heating the precursor to usually 300° C. or higher... thermal curability at 250° C. or lower is often desired
Data Source
AI summary
Provided is a photopolymer composition for a semiconductor element surface protective film or an interlayer insulating film, in which a solution of the photopolymer composition comprises 100 parts by mass of (A) a phenolic resin having a biphenyldiyl structure in a main chain of the resin; 1 to 30 parts by mass of (B) a photo acid-generating agent; and 1 to 60 parts by mass of (C) a compound that can be reacted with ingredient (A) by means of an acid generated from the photo acid-generating agent or heat.