Phenyl-Modified Metal Oxide Particles for High Dispersibility
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Solution Overview
Problem
Existing techniques for dispersing metal oxide particles in resin materials achieve high dispersibility but require a significant amount of modifying material, which can hinder the enhancement of electric characteristics.
Innovation Solution
A modified metal oxide particle material is produced by adhering a silicon-containing compound with a phenyl group to the surface of the metal oxide particles under controlled heating and drying conditions to inhibit reaction progression, allowing high dispersibility with a reduced amount of modifying material.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a significant amount of modifying material is used to achieve high dispersibility, then dispersibility is improved, but electric characteristics deteriorate
Solution Approach 1:
The patent changes the chemical parameters of the modifying material by specifying a silicon-containing compound with a phenyl group and controlling the reaction conditions (heating temperature and time) to limit the degree of reaction. This allows achieving adequate dispersibility while minimizing the amount of modifying material that would otherwise degrade electric characteristics.
Solution Approach 2:
The patent applies partial action by using a controlled amount of modifying material rather than excessive amounts. The reaction is deliberately kept incomplete (heating at 100°C or lower for 1 hour or less) to achieve sufficient surface modification for dispersibility without over-modification that would harm electric properties.
2Manufacturing precision
If heating temperature and time are increased to enhance reaction progression in modifying material, then modification effectiveness is improved, but performance of the modifying material deteriorates
Solution Approach 1:
The patent inverts the conventional approach by using low heating temperature (100°C or lower) and short heating time (1 hour or less) to achieve the desired modification effectiveness. This parameter change prevents excessive reaction that would degrade the modifying material's performance, while still providing sufficient surface modification for improved dispersibility.
3Object-generated harmful factors
If a small amount of modifying material is used, then electric characteristics are improved, but dispersibility deteriorates
Solution Approach 1:
The patent changes the reaction condition parameters (low temperature and short time) to achieve efficient surface modification with minimal modifying material. This allows using a small amount of modifier (achieving C/H ratio of 0.07 or less) while still obtaining sufficient dispersibility through the optimized reaction conditions.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The modified metal oxide particles exhibit enhanced dispersibility and inhibit reaction progression, maintaining performance with a minimal amount of modifying material, thereby improving mechanical and electric characteristics.
Implementation Method 1
a modifying material formed of a silicon-containing compound having a phenyl group, the modifying material being adhered to the surface of the metal oxide particle material
Data Source
AI summary
An object is to provide a modified metal oxide particle material that maintains high dispersibility even when the amount of modifying material is small. The material includes (i) a metal oxide particle material having, on its surface, a functional group other than a phenyl group; and (ii) a modifying material composed of a silicon-containing compound having a phenyl group, adhered to the surface of the metal oxide particle material. The value C/H, calculated from the carbon content C (mass %) and the specific surface area H (m{circumflex over ( )}2 per g), decreases by ≥0.001, ≥0.01, or ≥0.03 and <0.1 after washing with methyl ethyl ketone. The grind gauge is ≤20 μm. The post-wash C/H is ≤0.07.