Internet Phone Multiple-Layer Connecting Card EMI Reduction
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Solution Overview
Problem
Traditional internet phone systems using VoIP technology face issues with electromagnetic interference and unstable connections due to wire connections, which are prone to removal by external forces and occupy space.
Innovation Solution
An internet phone system that replaces traditional wire connections with a multiple-layer connecting card, which includes a circuit board between two metal plates for shielding and uses fastening units to securely connect the internet phone main body and expansion device, reducing electromagnetic interference and providing a cost-effective, space-saving solution.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If traditional wire connections are used to connect the internet phone and expansion module, then signal transmission can be achieved, but electromagnetic interference is generated and the connection is unstable due to external forces
Solution Approach 1:
The patent replaces the traditional mechanical wire connection system with a direct board-to-board electrical connection system using multiple-layer connecting cards. This substitution eliminates the physical wire that causes electromagnetic interference and connection instability, achieving both reduced EMI and improved connection reliability through integrated circuit board coupling.
Solution Approach 2:
The patent implements a nested structure where the circuit board is embedded within multiple-layer connecting cards that integrate multiple connection layers. This nesting approach allows multiple connection functions to be combined in a compact structure, eliminating the need for separate wires while reducing electromagnetic interference and improving connection stability.
2Productivity
If traditional wire connections are used, then signal transmission can be achieved, but space is occupied by the exposed wire
Solution Approach 1:
The patent replaces space-consuming physical wires with compact board-to-board electrical connections through multiple-layer connecting cards. This substitution dramatically reduces the volume occupied by connection components, improving space utilization while maintaining signal transmission functionality.
Solution Approach 2:
The patent transitions from three-dimensional wire routing to a two-dimensional board-to-board connection approach using multiple-layer connecting cards. This dimensional change allows connections to be made within the plane of the circuit boards, significantly reducing the space required for wire management and improving overall space utilization.
3Reliability
If wire connections are used, then connection can be established, but the wire is easily removed by external force causing unstable connection
Solution Approach 1:
The patent replaces the weak mechanical wire connection with a robust board-to-board electrical connection system. The rigid circuit board structure provides inherent mechanical strength that resists external forces, eliminating the vulnerability of flexible wires to accidental disconnection while maintaining electrical connectivity.
Solution Approach 2:
The patent merges the connection function with the structural body of the device by integrating multiple-layer connecting cards directly into the circuit board assembly. This merging eliminates the separate wire component that is vulnerable to external forces, creating a unified structure where the connection is as strong as the device housing itself.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The system effectively reduces electromagnetic interference and provides a stable connection without the need for traditional wires, enhancing communication reliability and efficiency while minimizing space occupation.
Implementation Method 1
the circuit board is located between the two metal plates
Data Source
AI summary
An internet phone system includes an internet phone main body, an expansion device and a multiple-layer connecting card. The internet phone main body includes a first connecting port. The at least one expansion device includes a second connecting port. One end of the multiple-layer connecting card is connected to the first connecting port, and the other end is connected to the second connecting port such that the internet phone main body can be electrically connected to the expansion device via the multiple-layer connecting card. The expansion device is capable of combining with another expansion device by another multiple-layer connecting card.