Phonon Disruptors in Thermal Sensor Interconnects

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Solution Overview

Problem

Conventional thermal sensors face challenges in increasing thermal resistance without compromising mechanical rigidity or electrical signal quality, as existing methods rely on lengthening or thinning interconnects, which can lead to stress-induced deformation and warping.

Innovation Solution

The use of phonon disruptors, specifically electrically conductive alloy materials or intermetallic materials with at least two elements, is introduced to scatter phonons while maintaining electrical conductivity, thereby increasing thermal resistance without the need for excessive thinning or lengthening of structures.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Loss of energy

If interconnects are lengthened or thinned to increase thermal resistance, then thermal resistance is improved, but mechanical rigidity deteriorates leading to stress-induced deformation and warping

Engineering Contradiction:

Improvethermal resistanceVSAvoidmechanical rigidity

Core Design Contradiction:

Loss of energyVSStrength

Solution Approach 1:

The patent changes the material parameters of the interconnect by introducing phonon disruptors (alloying elements or intermetallic phases) that selectively scatter phonons while having minimal impact on electron transport. This allows achieving high thermal resistance without changing the geometric parameters (length or thickness) of the interconnect, thereby maintaining mechanical rigidity.

Inventive Principle:

Principle #35Parameter changes

Solution Approach 2:

The patent employs composite material structures within the interconnect by incorporating phonon disruptors as secondary phases or alloying elements within the primary conductive material. This composite approach enables simultaneous optimization of thermal resistance (through phonon scattering) and electrical conductivity (through electron transport pathways), while maintaining mechanical strength.

Inventive Principle:

Principle #40Composite materials

2Loss of energy

If interconnects are lengthened or thinned to increase thermal resistance, then thermal resistance is improved, but electrical signal quality deteriorates

Engineering Contradiction:

Improvethermal resistanceVSAvoidelectrical signal quality

Core Design Contradiction:

Loss of energyVSReliability

Solution Approach 1:

The patent changes the thermal transport parameters of the interconnect material by introducing phonon disruptors that selectively target phonon scattering mechanisms. This selective parameter modification allows thermal resistance to be increased without proportionally increasing electrical resistance, as the phonon disruptors are designed to have minimal impact on electron transport.

Inventive Principle:

Principle #35Parameter changes

Solution Approach 2:

The patent uses composite material systems where the primary material maintains high electrical conductivity for signal transmission, while secondary phonon disruptor phases (alloying elements or intermetallics) provide thermal resistance. This composite structure enables decoupled optimization of thermal and electrical properties.

Inventive Principle:

Principle #40Composite materials

3Reliability

If conventional materials are used to maintain electrical conductivity, then electrical signal quality is preserved, but thermal resistance cannot be increased sufficiently

Engineering Contradiction:

Improveelectrical signal qualityVSAvoidthermal resistance

Core Design Contradiction:

ReliabilityVSLoss of energy

Solution Approach 1:

The patent introduces composite material systems consisting of a conductive base material combined with phonon disruptor phases. The base material ensures adequate electrical conductivity for signal transmission, while the phonon disruptor phases (through alloying or intermetallic formation) create strong phonon scattering centers that significantly increase thermal resistance.

Inventive Principle:

Principle #40Composite materials

Solution Approach 2:

The patent applies local quality modification by introducing phonon disruptors at specific locations or phases within the interconnect structure. The disruptors are strategically positioned or sized to maximize phonon scattering while minimizing impact on overall electrical conductivity, creating localized regions of high thermal resistance without compromising global electrical performance.

Inventive Principle:

Principle #3Local quality

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach enhances thermal resistance while maintaining acceptable electrical signal quality, leading to improved sensitivity and resolution in thermal sensing without compromising mechanical integrity.

Implementation Method 1

Phonon disruptors include the use of an electrically conductive alloy material or intermetallic material of at least two or more elements to promote scattering of phonons

Methodology Applied

Scientific EffectPhonon scattering: Scattering

Data Source

PatentUS12320707B2Phonon disruptors for increased thermal resistance without sacrificing electrical signal quality in thermal sensors using alloy and intermetallic materials

Publication Date: 2025.06.03 UNITED STATES OF AMERICA THE AS REPRESENTED BY THE SEC OF THE ARMY

AI summary

Sensor interconnects and supports and methods of making them utilize phonon disruptors for increased thermal resistance while maintaining acceptable electrical signal quality in materials. Phonon disruptors include the use of an electrically conductive alloy material or intermetallic material of at least two or more elements to promote scattering of phonons. These materials are selected to scatter heat carriers while allowing electrons to pass through the material.