Phononic Bandgap Structure for Ultrasonic IC Packaging

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Solution Overview

Problem

Existing integrated circuit (IC) packaging methods require additional steps for adding package functions, increasing costs and limiting functionality, and do not effectively incorporate phononic bandgap structures for enhanced performance.

Innovation Solution

Incorporating a phononic bandgap structure within the encapsulation material of IC packages using additive manufacturing, allowing for the integration of high-frequency phononic devices like ultrasonic emitters and detectors, and guiding ultrasound waves through designated channels within the encapsulant material.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Adaptability or versatility

If additional package functions are added to integrated circuit packaging, then functionality is enhanced, but manufacturing complexity and costs increase

Engineering Contradiction:

Improvepackage functionalityVSAvoidmanufacturing complexity

Core Design Contradiction:

Adaptability or versatilityVSDevice complexity

Solution Approach 1:

The patent merges multiple package functions into a single integrated structure by incorporating phononic bandgap structures, ultrasonic emitters, and detectors within the encapsulation material itself, eliminating the need for separate components and assembly steps

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The encapsulation material is designed to serve multiple functions simultaneously: mechanical protection, environmental sealing, and phononic device integration, allowing a single component to fulfill diverse packaging requirements

Inventive Principle:

Principle #6Universality (Multi-functionality)

2Reliability

If phononic bandgap structures are integrated into encapsulation material, then ultrasonic device performance is improved, but manufacturing process complexity increases

Engineering Contradiction:

Improveultrasonic device performanceVSAvoidmanufacturing process complexity

Core Design Contradiction:

ReliabilityVSDevice complexity

Solution Approach 1:

The patent utilizes parameter changes in the encapsulation material's physical and acoustic properties to create functional regions with different phononic characteristics, enabling device integration without fundamental process changes

Inventive Principle:

Principle #35Parameter changes

Solution Approach 2:

The encapsulation material is designed as a composite structure incorporating phononic bandgap materials that combine mechanical protection properties with acoustic waveguiding capabilities, achieving multiple functions in a single material system

Inventive Principle:

Principle #40Composite materials

3Productivity

If phononic devices are integrated during encapsulation, then production efficiency is improved, but manufacturing precision requirements increase

Engineering Contradiction:

Improveproduction efficiencyVSAvoiddevice integration precision

Core Design Contradiction:

ProductivityVSManufacturing precision

Solution Approach 1:

The phononic devices are prepared and positioned in advance during the encapsulation process, allowing integration to occur as part of the standard manufacturing flow rather than as a subsequent assembly step

Inventive Principle:

Principle #10Preliminary action

Solution Approach 2:

The encapsulation material exhibits locally differentiated properties with specific regions designed for phononic device placement, allowing precise device positioning through material property gradients rather than complex mechanical fixtures

Inventive Principle:

Principle #3Local quality

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

Enables the creation of IC packages with enhanced functionality, such as ultrasonic capabilities, while maintaining mechanical and environmental protection, and allows for the integration of additional package functions during the encapsulation process, reducing costs and complexity.

Implementation Method 1

Incorporating a phononic bandgap structure within the encapsulation material of IC packages

Methodology Applied

Scientific EffectPhononic bandgap: Phononic Crystal

Data Source

PatentUS10833648B2Acoustic management in integrated circuit using phononic bandgap structure

Publication Date: 2020.11.10 TEXAS INSTRUMENTS INC

AI summary

An encapsulated integrated circuit is provided that includes an integrated circuit (IC) die. A phonon device is fabricated on the IC die that is configured to emit or to receive phonons that have a range of ultrasonic frequencies. An encapsulation material encapsulates the IC die. A phononic bandgap structure is included within the encapsulation material that is configured to have a phononic bandgap with a frequency range that includes at least a portion of the range of ultrasonic frequencies. A phononic channel is located in the phononic bandgap structure between the phonon device and a surface of the encapsulated IC.