Phononic Crystal Superconducting Device Transition Width

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Solution Overview

Problem

Existing superconducting applications require cooling well below the transition temperature (Tc) to prevent resistive losses due to thermal phonon noise, leading to increased costs and time overhead, and a wide transition width that disrupts Cooper-pairs, limiting the quality factors and sensitivity of superconducting devices.

Innovation Solution

Engineering a phononic crystal with a periodic array of holes or plugs in a superconducting matrix material to create a phononic bandgap that suppresses decohering thermal phonon populations below the Cooper-frequency, thereby narrowing the superconducting transition width and reducing normal conduction electron populations near Tc.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If cooling is performed well below Tc to prevent resistive losses, then reliability is improved, but temperature overhead and cost increase

Engineering Contradiction:
Improvelossless superconducting operationVSAvoidcooling temperature requirement
Core Design Contradiction:
ReliabilityVSTemperature

Solution Approach 1:

The invention changes the phonon population parameter by introducing a phononic crystal structure with a bandgap at the Cooper frequency. This modifies the thermal phonon spectrum to suppress decohering phonons while maintaining superconductivity, allowing operation at higher temperatures closer to Tc without excessive resistive losses

Inventive Principle:
Principle #35Parameter changes

Solution Approach 2:

The phononic crystal acts as an intermediary structure that mediates between the thermal environment and the superconducting electrons. By creating a phononic bandgap, it filters out harmful thermal phonons that would otherwise cause Cooper-pair breaking, enabling relaxed cooling requirements

Inventive Principle:
Principle #24Intermediary (Mediator)

2Stability of the object's composition

If cooling is performed well below Tc to suppress thermal phonon noise, then superconducting stability is improved, but time overhead and operational complexity increase

Engineering Contradiction:
ImproveCooper-pair stabilityVSAvoidcooling time and operational overhead
Core Design Contradiction:
Stability of the object's compositionVSLoss of time

Solution Approach 1:

The phononic crystal structure is pre-engineered with a bandgap at the Cooper frequency before operation. This preliminary structural configuration proactively blocks harmful phonons from entering the superconducting region, eliminating the need for excessive cooling time to achieve stability

Inventive Principle:
Principle #10Preliminary action

3Reliability

If phononic bandgap engineering is implemented to narrow transition width, then device performance is improved, but structural complexity increases

Engineering Contradiction:
Improvesuperconducting transition sharpnessVSAvoidphononic crystal structure
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The phononic crystal is implemented as a periodic array of holes or posts that segments the superconducting material into unit cells. This segmentation creates the phononic bandgap effect while maintaining a relatively simple fabrication process using standard lithography and etching techniques

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The invention creates a composite structure combining superconducting material with a phononic crystal pattern (air holes or different material posts). This composite approach achieves phonon engineering while using compatible materials and fabrication processes with existing superconducting device manufacturing

Inventive Principle:
Principle #40Composite materials

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach allows for sharper superconducting transitions, relaxing cooling requirements, enhancing the quality factors and sensitivity of superconducting devices, and enabling higher performance in resonators, detectors, and transmission lines.

Implementation Method 1

the phononic crystal has a phononic bandgap at a frequency that suppresses a decohering thermal phonon population just below the Cooper-frequency of the matrix material

Methodology Applied
Scientific EffectPhononic bandgap: Phononic Crystal

Implementation Method 2

a phononic crystal (PnC) can be used to engineer a phononic frequency gap that suppresses the decohering thermal phonon population just below the Cooper-frequency (fc)

Methodology Applied
Scientific EffectPhonon scattering: Phononic Crystal

Implementation Method 3

the holes or plug material provide an acoustic impedance mismatch with the matrix material

Methodology Applied
Scientific EffectAcoustic impedance mismatch:

Implementation Method 4

suppressing the normal conduction electron population near Tc and narrowing the width of the superconducting transition

Methodology Applied
Scientific EffectCooper-pair decoherence suppression: Superconductivity

Data Source

PatentUS20220285603A1Superconductivity device comprising a phononic crystal
Publication Date: 2022.09.08 NATIONAL TECHNOLOGY & ENGINEERING SOLUTIONS OF SANDIA LLC
  • US20220285603A1 patent drawing
  • US20220285603A1 patent drawing
  • US20220285603A1 patent drawing

AI summary

The invention is directed to a device and method to engineer the superconducting transition width by suppressing the phonon populations responsible for the Cooper-pair decoherence below the superconducting transition temperature via phononic bandgap engineering. The device uses phononic crystals to engineer a phononic frequency gap that suppresses the decohering thermal phonon population just below the Cooper-frequency, and thus the normal conduction electron population. For example, such engineering can relax the cooling requirements for a variety of circuits yielding higher operational quality factors for superconducting electronics and interconnects.