Phononic Structures for Decoupling Thermal and Electrical Conductivity
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Solution Overview
Problem
Controlling thermal conductivity of materials independently of electrical conductivity remains challenging, particularly in thermoelectric applications where reducing thermal conductivity without affecting electrical conductivity is essential.
Innovation Solution
A phononic structure comprising a sheet of semiconductor material with regions having dissimilar phononic patterns, where the regions are designed to exhibit different phonon energy band structures, creating phononic interfaces that impede heat transfer while allowing electron transmission, thereby reducing thermal conductivity without affecting electrical conductivity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If phononic patterns are introduced to reduce thermal conductivity, then thermal conductivity is reduced, but electrical conductivity may be affected
Solution Approach 1:
The patent applies local quality by creating regions with different phononic patterns (different hole sizes, spacing, or arrangements) within the semiconductor material. These localized variations in phononic structure selectively scatter phonons while maintaining electron transport, achieving reduced thermal conductivity without compromising electrical conductivity in the overall material.
Solution Approach 2:
The patent segments the semiconductor material into multiple regions with dissimilar phononic patterns. By dividing the material into distinct zones with varying phononic features, the structure creates phononic interfaces that impede heat transfer while allowing electrical current to flow through the segmented paths.
2Temperature
If phononic interfaces are created to scatter phonons, then heat transfer is impeded, but material complexity increases
Solution Approach 1:
The patent employs porous materials by introducing arrays of holes or voids within the semiconductor material to create phononic patterns. These porous structures serve as phononic interfaces that scatter phonons and reduce thermal conductivity. The porosity is carefully controlled with specific hole sizes, spacing, and distributions to achieve desired thermal management while maintaining manufacturability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The phononic structure achieves reduced thermal conductivity while maintaining electrical conductivity, enhancing thermoelectric performance by creating phononic interfaces that scatter phonons, thus improving efficiency and thermoelectric properties.
Implementation Method 1
creating phononic interfaces that scatter phonons, thus improving efficiency and thermoelectric properties
Implementation Method 2
creating phononic interfaces that impede heat transfer while allowing electron transmission
Data Source
AI summary
Phononic structures, devices related to phononic structures, and methods related to fabrication of the phononic structures are described. The phononic structure can include a sheet of material, where the sheet of material can include a plurality of regions. Adjacent regions in the sheet of material can have dissimilar phononic patterns.