Two-Component Phosphate Coating for Heat-Dissipating Encapsulation
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Solution Overview
Problem
Current coating compositions for electronic components, particularly semiconductor modules, fail to effectively manage heat dissipation and electrical insulation on an industrial scale, as they do not provide adequate thermal management and can reach self-destructive temperatures without proper encapsulation.
Innovation Solution
A two-component composition comprising hydrogen phosphate, metal oxides, and particulate fillers, which, when mixed with water, forms an aqueous, hydraulically curable preparation that can be used as a coating to create a hardened, thermally conductive and electrically insulating layer for electronic components.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If conventional coating compositions are used for electronic components, then the components can be encapsulated, but they fail to effectively manage heat dissipation and electrical insulation
Solution Approach 1:
The patent employs a composite coating composition comprising multiple inorganic components including aluminum oxide, aluminum nitride, boron nitride, and silicon nitride particles dispersed in a phosphate cement matrix. This composite structure combines the thermal conductivity benefits of ceramic particles with the binding properties of phosphate cement, enabling effective heat dissipation while maintaining electrical insulation and mechanical protection of electronic components
Solution Approach 2:
The patent utilizes hydraulically curable phosphate cement that undergoes chemical transformation upon contact with moisture, changing from a liquid slurry state to a hardened solid state. This parameter change allows the coating to be applied in a workable liquid form and then transforms into a rigid, thermally conductive, and electrically insulating encapsulation that effectively manages heat while protecting electronic components
2Strength
If conventional coating compositions are used, then encapsulation can be formed, but they reach self-destructive temperatures without adequate thermal management
Solution Approach 1:
The coating composition integrates high thermal conductivity ceramic particles (aluminum oxide, aluminum nitride, boron nitride, silicon nitride) within a phosphate cement matrix, creating a composite material that simultaneously provides mechanical strength for encapsulation integrity and superior thermal conductivity to prevent heat buildup that would lead to self-destructive temperatures in semiconductor components
Solution Approach 2:
The phosphate cement acts as an intermediary bonding matrix that holds the thermally conductive ceramic particles in place while providing its own binding strength. This intermediary material transfers and distributes thermal energy through the ceramic network while maintaining the structural integrity of the encapsulation, preventing both mechanical failure and thermal runaway
3Productivity
If a two-component system is used for industrial scale production, then manufacturing efficiency improves, but the composition complexity increases
Solution Approach 1:
The coating system is segmented into two separate components: Component A containing the phosphate salt and ceramic particle mixture, and Component B containing the alkaline activator solution. This segmentation allows each component to be independently formulated, stored, and handled, simplifying industrial production and application while enabling controlled chemical reaction upon mixing to form the hardened coating
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively addresses the thermal management and insulation needs of electronic components by forming a hydraulically hardened coating that can withstand high temperatures, ensuring the longevity and performance of semiconductor modules during operation.
Implementation Method 1
an aqueous, hydraulically curable preparation usable as an encapsulating compound by mixing with water... hydraulically curable preparation that can be used to produce a hydraulically cured encapsulation
Implementation Method 2
dissipate heat from the electronic component to the outside during operation... thermally conductive and electrically insulating layer
Implementation Method 3
provide electrical insulation... electrically insulating layer
Data Source
AI summary
The invention relates to a composition consisting of: (a) 1 to 30 wt.% of at least one hydrogen phosphate selected from the group consisting of mono- and dihydrogen phosphates of sodium, potassium, ammonium, magnesium, calcium, aluminium, zinc, iron, cobalt and copper, optionally in combination with 1 to 90 wt.% aqueous phosphoric acid; (b) 1 to 40 wt.% of at least one compound selected from the group consisting of oxides, hydroxides and oxide hydrates of magnesium, calcium, iron, zinc and copper; (c) 40 to 95 wt.% of at least one particulate filling material selected from the group consisting of glass; mono-, oligo- and polyphosphates of magnesium, calcium, barium and aluminium; calcium sulphate; barium sulphate; simple and complex silicates comprising sodium, potassium, calcium, aluminium, magnesium, iron and/or zirconium; simple and complex aluminates comprising sodium, potassium, calcium, magnesium and/or zirconium; simple and complex titanates comprising sodium, potassium, calcium, aluminium, magnesium, barium and/or zirconium; simple and complex zirconates comprising sodium, potassium, calcium, aluminium and/or magnesium; zirconium dioxide; titanium dioxide; aluminium oxide; silicon dioxide; silicon carbide; aluminium nitride; boron nitride and silicon nitride; and (d) 0 to 25 wt.% of at least one component that is different from the components (a) to (c), wherein component (a) can comprise up to 10 wt.% of free water relative to the entire component (a), wherein component (d) can comprise up to 10 wt.% of water relative to the entire component (d), wherein the composition exists as a two- or multi-component system, and wherein the components (a) and (b) exist at least substantially separate from one another, or separate from one another if component (a) comprises phosphoric acid.