Phosphazene Flame Retardant with Resin Coating for Semiconductor Encapsulation
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Solution Overview
Problem
Conventional flame retardants for semiconductor devices, such as halogenated epoxy resins and antimony trioxide, pose environmental and safety hazards, and existing alternatives like hydroxides and phosphorous flame retardants either lack sufficient flame retardance or degrade in humid environments, compromising device reliability.
Innovation Solution
A flame retardant system comprising a phosphazene compound supported on inorganic porous particles with a thermally stable resin coating, which prevents hydrolysis and maintains effectiveness in humid conditions, ensuring high heat resistance and compliance with UL-94 V-0 standards.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If halogenated epoxy resin and antimony trioxide are used as flame retardants, then flame retardancy is improved, but environmental safety and device reliability deteriorate due to toxic gas emission and hazardous properties
Solution Approach 1:
The patent extracts and eliminates the harmful halogenated epoxy resin and antimony trioxide from the composition, replacing them with non-toxic alternatives (phosphazene compound supported on porous particle with resin coating) that provide flame retardancy without emitting poisonous gases or presenting environmental hazards
Solution Approach 2:
The patent employs a composite flame retardant structure consisting of a phosphazene compound supported on a porous particle and coated with a resin layer. This composite design combines the flame-retardant properties of phosphazene with the protective and stabilizing characteristics of the resin coating, achieving both safety and effectiveness
2Object-affected harmful factors
If hydroxides such as Al(OH)3 and Mg(OH)2 are used as flame retardants, then environmental safety is improved, but flame retardancy is insufficient requiring large amounts which increases viscosity and causes molding defects
Solution Approach 1:
The patent changes the chemical composition parameter from conventional hydroxides to phosphazene compound, which provides superior flame retardancy at lower concentrations. This parameter change maintains environmental safety while avoiding the viscosity increase and molding defects associated with large amounts of hydroxide additives
Solution Approach 2:
The patent utilizes a porous particle support structure for the phosphazene compound. The porous architecture provides high surface area and dispersibility, enabling effective flame retardancy at low loadings without adversely affecting the viscosity or moldability of the epoxy resin composition
3Object-affected harmful factors
If phosphorous flame retardants such as red phosphorous and phosphates are used, then environmental safety is improved, but reliability deteriorates due to hydrolysis in high humidity forming corrosive phosphoric acid
Solution Approach 1:
The patent introduces a resin coating layer as an intermediary between the phosphazene compound and the external environment. This coating acts as a protective barrier that prevents moisture from reaching the phosphazene compound, thereby preventing hydrolysis and the formation of corrosive phosphoric acid while maintaining environmental safety
Solution Approach 2:
The patent applies different functional properties to different parts of the flame retardant structure: the phosphazene compound provides flame retardancy, the porous particle provides support and dispersibility, and the resin coating provides moisture protection. This local differentiation of properties enables the system to simultaneously achieve environmental safety and reliability in humid conditions
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The phosphazene compound-based flame retardant system provides effective flame retardance without hazardous emissions, maintains device reliability in humid environments, and achieves high heat resistance, ensuring semiconductor devices meet stringent safety standards.
Implementation Method 1
a resin layer coating the inorganic porous fine particle with the phosphazene compound supported thereon, which resin layer has predetermined thermal decomposition property... the resin layer thermally decomposes to lose weight by 10% at a temperature of from 300° C. to 500° C.
Implementation Method 2
This combination of the halogenated epoxy resin and antimony trioxide shows high radical trapping and air shielding effects in a vapor phase to provide high flame retardancy to the composition
Implementation Method 3
This combination of the halogenated epoxy resin and antimony trioxide shows high radical trapping and air shielding effects in a vapor phase to provide high flame retardancy to the composition
Data Source
AI summary
A flame retardant featuring: an inorganic porous fine particle, a phosphazene compound represented by the following average compositional formula (1)(X is a single bond, CH2, C(CH3)2, SO2, S, 0, or O(CO)O; n is an integer of from 3 to 1000; d and e are numbers with 2d+e=2n), and a resin layer. The phosphazene compound is supported on the inorganic porous fine particle, and the resin layer coats the inorganic porous fine particle with the phosphazene compound supported thereon. The resin layer thermally decomposes to lose weight by 10% at a temperature of from 300° C. to 500° C., as measured by thermogravimetry in the air at a heating rate of 10° C./min.