Phosphazene Compound for Low Dielectric PCB Materials
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Solution Overview
Problem
Current printed circuit board materials face challenges in achieving low dielectric constant and low dielectric loss, which are crucial for high-frequency signal transmission, while also requiring good heat resistance and mechanical properties.
Innovation Solution
A phosphazene compound with a specific molecular structure, comprising aromatic and aliphatic hydrocarbon groups, inert nucleophilic groups, and cyclotriphosphazene or non-cyclic polyphosphazene groups, is developed to provide low dielectric properties, heat resistance, and mechanical stability, which is used in epoxy resin compositions for printed circuit boards.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of energy
If conventional printed circuit board materials are used, then manufacturing cost is controlled, but dielectric constant and dielectric loss are too high for high-frequency signal transmission
Solution Approach 1:
The patent changes the chemical composition parameters of the resin by incorporating phosphazene compounds with specific molecular structures (Formula I) containing aromatic and aliphatic hydrocarbon groups. This chemical parameter change achieves low dielectric constant (3.28-3.33) and low dielectric loss (0.005-0.006) while maintaining manufacturing feasibility through established epoxy resin processing methods
Solution Approach 2:
The patent creates a composite material system by combining phosphazene compounds with epoxy resin, curing agents, and optional fillers. This composite approach achieves superior electrical properties (low dielectric constant and loss) while balancing mechanical properties and heat resistance, resolving the contradiction between performance and manufacturing ease
2Speed
If materials with low dielectric constant are developed, then signal transmission speed is improved, but heat resistance and mechanical properties may deteriorate
Solution Approach 1:
The patent employs a composite material system where phosphazene compounds provide low dielectric properties for high signal transmission speed, while the epoxy resin matrix and curing agents maintain mechanical strength and heat resistance. The synergistic combination ensures both electrical performance and structural integrity
Solution Approach 2:
The patent applies local quality by using phosphazene compounds with specific local molecular structures (aromatic and aliphatic hydrocarbon groups at specific positions in Formula I) to achieve low dielectric properties in critical areas, while the overall composite material maintains uniform mechanical strength and heat resistance throughout
3Loss of energy
If materials with low dielectric loss are used, then signal transmission quality is improved, but Tg and mechanical properties may be compromised
Solution Approach 1:
The patent changes the chemical parameters by selecting phosphazene compounds with specific molecular structures that achieve low dielectric loss (0.005-0.006) while maintaining Tg of 175°C or higher. The specific arrangement of aromatic and aliphatic hydrocarbon groups in Formula I enables this dual optimization
Solution Approach 2:
The composite material system combines phosphazene compounds for low dielectric loss with epoxy resin and curing agents for high Tg and mechanical properties. This composite approach resolves the contradiction between energy loss and thermal-mechanical performance
Data Source
AI summary
The present invention relates to a phosphazene compound and a prepreg and a composite metal laminate. The phosphazene compound has a structure as shown in Formula (I). The present invention obtains a phosphazene compound using an M group having specific components. The composite metal laminates prepared by the epoxy resin composition comprising the phosphazene compound have low dielectric properties, good heat resistance and mechanical properties and is a low dielectric material also having great economic properties and being environmental friendly.