Phosphor Conversion Element Bonding for LED Heat Dissipation
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional radiation-emitting components face challenges with thermal conductivity due to the use of adhesives like silicone, which limits their ability to operate at high currents and temperatures, and also introduces optical barriers affecting brightness.
Innovation Solution
A radiation-emitting component with a semiconductor chip and a conversion element that is directly attached to the chip without an adhesive layer, utilizing a matrix material with phosphor particles to convert electromagnetic radiation, and featuring a bearing surface that is equal to or smaller than the cover surface of the semiconductor chip for improved thermal conduction.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If an adhesive layer (e.g., silicone) is used to attach the conversion element to the semiconductor chip, then the component can be easily manufactured and assembled, but the thermal conductivity is reduced and optical barriers are introduced
Solution Approach 1:
The adhesive layer is completely removed from the system. The conversion element is attached directly to the semiconductor chip's cover surface through direct contact, eliminating the thermal and optical barriers that adhesive layers create. This extraction of the problematic intermediate layer resolves the thermal conduction issue while maintaining manufacturability through direct attachment methods.
Solution Approach 2:
The semiconductor chip's cover surface itself serves as the intermediary between the conversion element and the heat source, providing both mechanical support and thermal conduction pathways. By using the chip's own surface as the attachment interface rather than introducing an external adhesive layer, the system achieves both ease of manufacture and improved thermal management.
2Device complexity
If an adhesive layer is used to attach the conversion element, then the component structure is simplified, but optical losses increase due to the adhesive acting as an optical barrier
Solution Approach 1:
The adhesive layer is removed from the optical path between the semiconductor chip and conversion element. By eliminating this intermediate optical barrier, light transmission is improved and optical losses are reduced, while the direct attachment maintains structural simplicity through a single-interface design.
3Ease of manufacture
If a conventional adhesive attachment method is used, then manufacturing is easier, but the component cannot operate at high currents and temperatures effectively
Solution Approach 1:
The adhesive layer is extracted from the system, removing the thermal barrier that limited high-current operation. The direct contact between the conversion element and semiconductor chip enables effective heat dissipation even under high current densities, while manufacturing remains simple through direct attachment processes.
Solution Approach 2:
The thermal interface parameters are changed by eliminating the adhesive layer, transitioning from a high-thermal-resistance interface to a low-thermal-resistance direct contact interface. This parameter change enables the component to operate reliably at high currents and temperatures while maintaining manufacturing simplicity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The direct attachment of the conversion element enhances thermal conduction, allowing the component to operate at high currents and temperatures without thermal barriers, while also simplifying manufacturing and reducing optical losses.
Implementation Method 1
the conversion element containing a matrix material and phosphor particles embedded therein, which convert electromagnetic radiation of the first wavelength range into electromagnetic radiation of a second wavelength range
Implementation Method 2
the bearing surface is completely in direct contact with the cover surface of the semiconductor chip... enhances thermal conduction
Data Source
AI summary
A radiation-emitting component includes a semiconductor chip which, in operation, emits electromagnetic radiation of a first wavelength range from a radiation exit surface, and a conversion element on a cover surface of the semiconductor chip comprising the radiation exit surface. The conversion element contains a matrix material and phosphor particles embedded therein which convert electromagnetic radiation of the first wavelength range into electromagnetic radiation of a second wavelength range. The conversion element has a bearing surface which is equal to or smaller than the cover surface of the semiconductor chip, and the bearing surface is completely in direct contact with the cover surface of the semiconductor chip. A method for producing a radiation-emitting component is further disclosed.