Phosphor Film LED Package Ceramic Substrate Thermal Reliability
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Solution Overview
Problem
Conventional LED packages face efficiency deterioration and temperature reliability issues due to resin discoloration and poor phosphor performance, especially with high-power light sources, limiting their effectiveness in lighting applications.
Innovation Solution
A light emitting device package incorporating a phosphor film manufactured using a method involving a support substrate, a phosphor film green sheet, and a glass film green sheet, which are patterned and sintered to enhance light extraction efficiency and facilitate easier fabrication of large-area plates, improving light emission efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If a mixture of phosphor and encapsulation resin is applied to the light emitting device, then the device can be manufactured using conventional processes, but efficiency deterioration occurs due to resin discoloration and poor temperature reliability
Solution Approach 1:
The patent extracts the phosphor from the resin encapsulation medium and places it in a separate ceramic plate structure. The phosphor is embedded in a ceramic matrix rather than being mixed with organic resin, thereby eliminating the resin discoloration problem while maintaining manufacturability through ceramic processing techniques.
Solution Approach 2:
The patent uses composite materials by combining phosphor particles with ceramic materials to create a phosphor-ceramic composite plate. This composite structure provides both the wavelength conversion function of the phosphor and the thermal stability and mechanical strength of the ceramic, resolving the temperature reliability issue.
2Power
If high power light sources are used to enhance LED performance, then the brightness and efficiency of LEDs are improved, but the resin and phosphor deteriorate and discolor due to high temperature
Solution Approach 1:
The patent employs a ceramic plate that can withstand high temperatures without deteriorating, replacing the temperature-sensitive resin encapsulation. The ceramic structure serves as a durable, heat-resistant substrate that maintains structural integrity and optical properties even under high-power operation conditions.
Solution Approach 2:
The patent changes the material parameter from organic resin to inorganic ceramic, which fundamentally alters the temperature resistance characteristics. This material substitution enables the system to operate at higher temperatures without degradation, allowing high-power LED operation while maintaining reliability.
3Use of energy by moving object
If a phosphor film is fabricated for large-area plates, then light emission efficiency can be enhanced, but the fabrication process becomes more complex and costly
Solution Approach 1:
The patent segments the phosphor application into a separate ceramic plate component that can be manufactured independently using established ceramic processing techniques. This segmentation allows for simplified large-area fabrication compared to applying phosphor-resin mixtures, as ceramic plates can be produced using standard tile-making processes adapted for phosphor embedding.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enhances light extraction and conversion efficiency, addresses temperature reliability concerns, and simplifies the fabrication process for large-area phosphor films, leading to improved performance and cost-effectiveness in LED packages.
Implementation Method 1
a phosphor plate that is a wavelength converter and that converts a portion of the blue light emitted from the blue LED into yellow light as secondary light having a longer peak wavelength
Implementation Method 2
a method of manufacturing the light emitting device package, and a lighting apparatus using the light emitting device package
Data Source
Figure 1(a)~1(e)
Figure 2(a)~2(e)
Figure 3(a)~4
AI summary
A light emitting device package, and more particularly, a light emitting device package including a phosphor film, a method of manufacturing the same, and a lighting apparatus using the same are disclosed. The method of manufacturing a light emitting device package including a phosphor film, includes attaching a phosphor film green sheet on a first surface of a support substrate, attaching a glass film green sheet on the phosphor film green sheet, patterning the glass film green sheet by mold pressing, and sintering the phosphor film green sheet and the patterned glass film green sheet.