Direct-Bonded Wavelength Conversion Module for Phosphor Heat Dissipation

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Solution Overview

Problem

Existing wavelength conversion modules face challenges in efficiently dissipating heat generated by phosphor members, leading to reduced reliability and wavelength conversion efficiency, particularly in high-output light sources.

Innovation Solution

A wavelength conversion module is designed with a light-transmissive substrate directly bonded to the phosphor member, having a thermal conductivity higher than the phosphor member and a thickness ranging from 100 μm to 600 μm, to efficiently dissipate heat generated in the phosphor member.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Power

If a phosphor member is used for wavelength conversion in high-output light sources, then wavelength conversion capability is improved, but heat generation increases and reliability deteriorates

Engineering Contradiction:
Improveoutput light source powerVSAvoidwavelength conversion module reliability
Core Design Contradiction:
PowerVSReliability

Solution Approach 1:

A light-transmissive substrate is introduced as an intermediary component between the phosphor member and the external environment. This substrate has higher thermal conductivity than the phosphor member and directly contacts it to facilitate heat transfer away from the phosphor member, thereby improving reliability while maintaining high-power operation capability

Inventive Principle:
Principle #24Intermediary (Mediator)

Solution Approach 2:

The thermal conductivity parameter of the substrate is specifically optimized to be higher than that of the phosphor member. The thickness of the substrate is controlled within a specific range (100-600 μm) to balance light transmission and heat dissipation functions, resolving the contradiction between power output and reliability

Inventive Principle:
Principle #35Parameter changes

2Power

If a phosphor member is used for wavelength conversion, then wavelength conversion function is achieved, but heat dissipation is insufficient and conversion efficiency deteriorates

Engineering Contradiction:
Improvewavelength conversion efficiencyVSAvoidphosphor member temperature
Core Design Contradiction:
PowerVSTemperature

Solution Approach 1:

The light-transmissive substrate serves as a thermal intermediary that conducts heat away from the phosphor member more effectively than the phosphor member itself can dissipate it. This maintains lower operating temperature in the phosphor member, preserving wavelength conversion efficiency at high power levels

Inventive Principle:
Principle #24Intermediary (Mediator)

Solution Approach 2:

The light-transmissive substrate performs multiple functions simultaneously: it transmits light from the phosphor member while also serving as a heat dissipation pathway. This multi-functionality allows improved temperature management without compromising optical performance or adding separate components

Inventive Principle:
Principle #6Universality (Multi-functionality)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The design enhances heat dissipation, improves reliability, and maintains high wavelength conversion efficiency, even in high-output light sources.

Implementation Method 1

a light-transmissive substrate that is directly bonded to the phosphor member, has a thermal conductivity higher than a thermal conductivity of the phosphor member

Methodology Applied
Scientific EffectThermal conduction: Conduction (thermal)

Implementation Method 2

a phosphor member... that allows the excitation light to enter the phosphor member... the phosphor member generates heat with the wavelength conversion

Methodology Applied
Scientific EffectWavelength conversion: Photoluminescence

Data Source

PatentUS12571519B2Wavelength conversion module, light emission device, and method for manufacturing wavelength conversion module
Publication Date: 2026.03.10 NICHIA CORP
  • US12571519B2 patent drawing
  • US12571519B2 patent drawing
  • US12571519B2 patent drawing

AI summary

A wavelength conversion module includes: a phosphor member; and a light-transmissive substrate that is directly bonded to the phosphor member, wherein a higher thermal conductivity of the light-transmissive substrate is higher than a thermal conductivity of the phosphor member, and the light-transmissive substrate has a thickness in a range from 100 μm to 600 μm.