Direct Phosphor Contact on LED Chip via Enclosing Layer Removal
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Solution Overview
Problem
Existing LED chip package structures using phosphor resin face inefficiencies in ensuring direct contact between phosphor particles and the LED chip, as the phosphor particles are often encapsulated within a package material, limiting their effectiveness in light emission and protection.
Innovation Solution
A method involving a phosphor film with an outer enclosing layer is used, where the enclosing layer is removed to expose the phosphor layer, allowing it to directly cover the LED chip, and a phosphor protection layer is formed to cover the chip's surface, ensuring direct contact and protection without non-phosphor materials.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If phosphor particles are mixed with package material to form phosphor resin, then the phosphor particles are protected and easily applied, but the phosphor particles cannot directly contact the LED chip, reducing light emission effectiveness
Solution Approach 1:
The patent extracts the phosphor particles from the package material matrix by using a water-soluble adhesive that can be removed with water. This allows the phosphor particles to be separated from the encapsulating material, enabling direct contact with the LED chip while maintaining the protective function of the package material
Solution Approach 2:
The patent applies phosphor particles to the LED chip surface before applying the package material in a preliminary step. The water-soluble adhesive is used to temporarily hold the phosphor particles in position during this preliminary phase, allowing subsequent removal to achieve direct contact
2Reliability
If phosphor particles are encapsulated within package material, then the structure is simplified and easier to manufacture, but the phosphor particles are not directly protected, reducing reliability
Solution Approach 1:
The patent uses water as an intermediary substance to remove the water-soluble adhesive that initially held the phosphor particles. This simple intermediary approach enables the transformation from encapsulated to direct-contact configuration without requiring complex manufacturing processes
Solution Approach 2:
The patent changes the physical-chemical parameters of the adhesive by exploiting its water-solubility property. By controlling the presence or absence of water, the adhesive transitions from a binding state to a removable state, enabling the phosphor particles to be released for direct chip contact
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables the phosphor particles to directly contact the LED chip, enhancing light emission and protection, and forming a robust phosphor protection layer that covers the chip's surface, improving the overall performance and reliability of the LED chip package.
Implementation Method 1
using a solvent to dissolve the outer enclosing layer so as to remove the outer enclosing layer from the phosphor layer and expose the phosphor layer
Data Source
AI summary
An LED chip package structure and a method of manufacturing the same are provided. The method of manufacturing the LED chip package structure includes providing a phosphor film including a phosphor layer and an outer enclosing layer for enclosing the phosphor layer that includes a plurality of phosphor particles; removing the outer enclosing layer from the phosphor layer for exposing the phosphor layer; and then covering an LED chip with the phosphor layer. The LED chip package structure includes an LED chip and a phosphor layer for covering the LED chip. The phosphor layer includes a plurality of phosphor particles tightly connected with each other, and the phosphor layer has no non-phosphor material. Therefore, the LED chip can be directly covered by the phosphor layer without the outer enclosing layer, and the phosphor particle without the non-phosphor material can directly contact the LED chip.