Phosphor-Coated LED Packaging Substrate Reuse
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Solution Overview
Problem
Conventional LED packaging processes result in waste and inefficiency due to the slicing of carrier substrates during the dicing process, which makes them unusable again.
Innovation Solution
A method of packaging phosphor-coated LEDs where the substrate is removed before dicing, allowing it to be reused, and a phosphor film is coated around the LEDs to transform blue light into white light, eliminating the need for additional lenses and reducing packaging costs and time.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If the carrier substrate is sliced during the dicing process to separate LEDs, then the LEDs are successfully singulated, but the carrier substrate is wasted and cannot be reused
Solution Approach 1:
The process separates the LED singulation function from the carrier substrate destruction. LEDs are singulated by dicing only the LED array while the carrier substrate remains intact through the use of a sacrificial layer that is removed after dicing, allowing the carrier substrate to be reused for future LED mounting.
Solution Approach 2:
A sacrificial layer is introduced as an intermediary between the carrier substrate and the LED array. This sacrificial layer enables the dicing process to separate LEDs without cutting the carrier substrate, as the sacrificial layer is removed after dicing, leaving the carrier substrate intact for reuse.
2Device complexity
If conventional LED packaging is used without phosphor coating, then the packaging process is simpler, but additional lenses are required which increase device complexity and cost
Solution Approach 1:
The phosphor coating layer is applied directly to the LED chip surface during the packaging process, merging the optical transformation function (converting blue light to white light) with the packaging structure. This eliminates the need for separate lenses while maintaining manufacturing simplicity.
Solution Approach 2:
The phosphor coating serves multiple functions: it acts as the packaging seal, provides optical transformation (blue to white light conversion), and eliminates the need for additional lenses. This multi-functionality reduces device complexity while maintaining ease of manufacture.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method reduces waste, enhances efficiency by reusing the substrate, and produces a compact LED package with improved light output by using the phosphor film as a lens, thereby reducing packaging costs and time.
Implementation Method 1
a phosphor film is coated around the LEDs to transform blue light into white light
Data Source
AI summary
The present disclosure involves a method of packaging light-emitting diodes (LEDs). According to the method, a plurality of LEDs is provided over an adhesive tape. The adhesive tape is disposed on a substrate. In some embodiments, the substrate may be a glass substrate, a silicon substrate, a ceramic substrate, and a gallium nitride substrate. A phosphor layer is coated over the plurality of LEDs. The phosphor layer is then cured. The tape and the substrate are removed after the curing of the phosphor layer. A replacement tape is then attached to the plurality of LEDs. A dicing process is then performed to the plurality of LEDs after the substrate has been removed. The removed substrate may then be reused for a future LED packaging process.