Phosphor-Rich Wavelength Conversion Layer for Heat-Conductive Resin Sealing
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Solution Overview
Problem
Existing wavelength conversion members face challenges in high-power applications due to the limitations of inorganic materials for sealing, which are costly and prone to thermal stress, while resin materials offer advantages in cost and thermal resistance but lack heat conducting properties.
Innovation Solution
A wavelength conversion member design featuring a phosphor particle group with a high cross-sectional area rate, including large and small-diameter phosphor particles sealed by a silicone resin, enhances heat conductivity and allows high-intensity fluorescence extraction.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If inorganic materials are used to form the sealing member, then heat conducting properties are improved, but cost increases and thermal stress resistance deteriorates
Solution Approach 1:
The patent changes the physical parameters of the phosphor particles (size, shape, distribution) to optimize heat conduction pathways within the resin matrix, achieving improved heat conducting properties without requiring inorganic sealing materials. The phosphor particles with specific size ranges (0.1-10 μm) and controlled distributions create efficient thermal conduction networks while maintaining resin-based sealing advantages.
Solution Approach 2:
The patent creates a composite structure where phosphor particles are embedded in a resin matrix, forming a wavelength conversion layer that combines the light-converting properties of phosphor with the flexible, low-stress properties of resin. This composite approach allows the resin to serve as both the sealing member and the matrix material, eliminating the need for separate inorganic sealing layers while maintaining thermal management capabilities.
2Ease of manufacture
If resin is used as the sealing member, then cost decreases and thermal stress resistance improves, but heat conducting properties deteriorate
Solution Approach 1:
The patent modifies the resin matrix composition and the phosphor particle characteristics to enhance thermal conduction. By controlling phosphor particle size (0.1-10 μm), shape (spherical, irregular), and distribution density within the resin, the invention creates optimized heat conduction pathways that allow resin-based sealing members to achieve sufficient thermal management for high-power applications.
Solution Approach 2:
The patent uses phosphor particles with specific morphological characteristics (size, shape, surface properties) that naturally create efficient thermal conduction networks within the resin matrix, effectively copying the heat conduction functionality typically provided by inorganic materials through carefully selected organic-composite structures.
3Power
If phosphor particle diameter is increased to improve emission intensity, then high-power application performance improves, but manufacturing precision requirements increase
Solution Approach 1:
The patent establishes a broad optimal particle size range (0.1-10 μm) that balances emission intensity with manufacturing feasibility. Within this range, particles of 1-5 μm provide optimal surface area to volume ratios for efficient light conversion, while the broad acceptable range (0.1-10 μm) accommodates normal manufacturing variations without significantly impacting performance, thus reducing precision requirements.
Solution Approach 2:
The patent employs phosphor particles with sizes that may exceed traditional precision thresholds but fall within the optimized range, accepting slight variations in particle dimensions while maintaining overall high emission intensity through sufficient particle density and optimized distribution within the wavelength conversion layer.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design achieves excellent heat conducting properties, enabling high-intensity excitation light irradiation and a wide range of sealing material choices, including resin, while maintaining high fluorescence intensity.
Implementation Method 1
a wavelength conversion layer that comprises a phosphor particle group and a sealing member to seal the phosphor particle group
Implementation Method 2
the wavelength conversion member... has excellent heat conducting properties
Data Source
AI summary
A wavelength conversion member includes a support, and a wavelength conversion layer that includes a phosphor particle group and a sealing member to seal the phosphor particle group and that is provided directly or through an other layer on the support. A predetermined region, in which a cross-sectional area rate of the phosphor particle group is not less than 50%, is included in an arbitrary cross section of the wavelength conversion layer taken parallel to a thickness direction thereof. The predetermined region includes a rectangular region with a width of 700 μm and a thickness of 50 μm from a bottom surface of the wavelength conversion layer when a thickness of the wavelength conversion layer is not less than 50 μm, or a rectangular region with a width of 700 μm and a thickness equal to the thickness of the wavelength conversion layer when it is less than 50 μm.