Polysilsesquioxane Phosphor Wheel Binder for Heat Dissipation

The patent changes the chemical composition parameters of the binder by incorporating polysilsesquioxane (containing Si-O-Si bonds) into the silicone resin matrix. This compositional parameter change transforms the binder from poor thermal conductor to excellent thermal conductor, enabling effective heat dissipation while maintaining manufacturing feasibility. The polysilsesquioxane content is controlled at 1-50 wt% to optimize both thermal conduction and mechanical properties.

The patent converts the harmful heat generated by high-intensity incident light into a manageable parameter by introducing polysilsesquioxane as a thermal conduction pathway. The heat that would normally cause binder alteration is now efficiently conducted away through the polysilsesquioxane network, allowing high power operation without temperature-related degradation. The harmful thermal energy is transformed into a controlled heat flow that can be dissipated.

The patent creates a composite binder material by combining silicone resin (providing ease of manufacture, flexibility, and adhesion) with polysilsesquioxane (providing excellent thermal conduction). This composite approach allows the material to simultaneously exhibit processing advantages of conventional silicone resin and superior thermal management properties. The polysilsesquioxane forms a three-dimensional network within the silicone matrix, creating a hybrid material that leverages the strengths of both components.