Phosphorous Diamine Polyimide Resin for OLED Insulation
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Solution Overview
Problem
Conventional polyimide resins used in semiconductor devices, particularly for organic light emitting diodes (OLEDs), require complex manufacturing processes involving additional photoresist and etching steps with organic solvents, leading to environmental issues and pattern swelling, and lack sufficient etching resistance at high temperatures.
Innovation Solution
A positive photosensitive resin composition comprising an alkali soluble resin prepared from a phosphorous-containing diamine and a photosensitive diazoquinone compound, providing improved photosensitivity, high residue removal rate, and excellent etching and heat resistance, which can be used to form a photosensitive resin film suitable for semiconductor devices.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a conventional polyimide resin is used for insulation layer, then heat resistance and mechanical strength are improved, but the manufacturing process becomes complex requiring additional photoresist and etching processes
Solution Approach 1:
The patent combines the insulation layer material and photoresist into a single integrated composition. The polyimide resin serves dual functions as both the insulation layer base material and the photoresist for patterning, eliminating the need for separate photoresist coating and etching processes while maintaining heat resistance and mechanical strength properties
2Manufacturing precision
If additional photoresist and etching processes are used, then patterning is achieved, but environmental problems and pattern swelling occur due to organic solvent use
Solution Approach 1:
The patent extracts and eliminates the harmful organic solvent etching step from the manufacturing process. By incorporating photosensitive groups directly into the polyimide resin structure, the material can be patterned through photodecomposition and water-soluble byproduct formation, removing the need for environmentally harmful organic solvents and preventing pattern swelling
Solution Approach 2:
The patent converts the potential harm of using polyimide resin as photoresist (complexity) into a benefit by selecting specific polyimide structures that decompose cleanly upon exposure. The photodecomposition produces water-soluble carboxylic acid groups that facilitate easy removal without organic solvents, turning what could be a complex process into a simplified, environmentally friendly one
3Reliability
If resin material includes more carbon for etching resistance, then etching resistance is improved, but the resin may be exposed at high temperature of 400°C or higher
Solution Approach 1:
The patent changes the chemical composition parameters of the polyimide resin by incorporating specific aromatic diamine structures with high carbon content (such as biphenyl, naphthalene, or anthracene units) while maintaining thermal stability. This achieves etching resistance without compromising the ability to withstand high-temperature processing at 400°C or higher
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The resin composition simplifies the manufacturing process, reduces environmental impact, and enhances the thermal stability and etching resistance of semiconductor devices, making it suitable for use in OLED displays as a protective layer or pixel crystal layer.
Implementation Method 1
a photosensitive diazoquinone compound
Data Source
AI summary
Disclosed is a positive photosensitive resin composition that includes (A) an alkali soluble resin prepared by a phosphorous-containing diamine represented by the following Chemical Formula 1, (B) a photosensitive diazoquinone compound, and (C) a solvent. A photosensitive resin film prepared using the same and a semiconductor device including the photosensitive resin film are also disclosed.In Chemical Formula 1, each substituent is the same as defined in the detailed description.