Phosphorus-Containing Polyester Composite for Low-Dielectric Epoxy Curing
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Solution Overview
Problem
Current materials for high-frequency substrates in electronics lack sufficient flame retardancy, heat resistance, and low dielectric properties, with traditional halogen-based flame retardants posing environmental hazards and affecting mechanical properties.
Innovation Solution
A low-dielectric phosphorus-containing polyester composite is developed by condensing a poly-functional phosphorus-containing aromatic hydroxy compound, a difunctional aromatic acyl chloride, and a monofunctional aromatic phenol compound, which reacts with epoxy to form a cured composite with enhanced flame retardancy and heat resistance, replacing halogen-based flame retardants with an organic phosphorus group.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If halogen-based flame retardants are used to achieve flame retardancy, then flame retardant performance is improved, but environmental harm increases and mechanical properties deteriorate
Solution Approach 1:
The patent changes the chemical composition parameter by replacing halogen-based flame retardants with phosphorus-containing compounds. Specifically, it uses phosphorus-containing aromatic hydroxy compounds with specific molecular structures (where R1-R6 are hydrogen, alkyl, or aromatic hydrocarbon groups) to achieve flame retardancy without the harmful environmental effects of halogens, while maintaining or improving mechanical properties through the aromatic structure's inherent strength.
Solution Approach 2:
The patent creates a composite material system combining phosphorus-containing aromatic hydroxy compounds with epoxy resins and optional inorganic fillers (such as aluminum hydroxide, magnesium hydroxide, or silica). This composite approach achieves synergistic effects where the phosphorus compound provides flame retardancy, the epoxy provides mechanical strength, and the inorganic fillers enhance both flame retardancy and mechanical properties, eliminating the need for harmful halogen additives.
2Strength
If traditional epoxy resin is used to ensure mechanical strength and adhesion, then mechanical properties are improved, but flame retardancy and heat resistance are insufficient
Solution Approach 1:
The patent merges the functions of structural epoxy resin and flame retardant by combining epoxy resin with phosphorus-containing aromatic hydroxy compounds in a single composition system. The phosphorus compound integrates into the epoxy matrix, providing both flame retardancy and heat resistance while the epoxy provides mechanical strength and adhesion, achieving multi-functionality in one material system.
Solution Approach 2:
The patent develops a composite material consisting of epoxy resin as the base matrix and phosphorus-containing aromatic hydroxy compounds as functional additives. This composite structure allows the epoxy to maintain its excellent mechanical properties while the phosphorus compound imparts flame retardancy and heat resistance, creating a material that simultaneously satisfies multiple performance requirements.
3Quantity of substance
If conventional materials are used for high-frequency substrates to maintain cost-effectiveness, then manufacturing cost is reduced, but dielectric properties and heat resistance are insufficient
Solution Approach 1:
The patent changes the chemical structure parameters of the curing agent by using phosphorus-containing aromatic hydroxy compounds with specific molecular configurations. The aromatic rings and phosphorus atoms in the molecular structure contribute to low dielectric constant and low dielectric loss factor, while the compound's reactivity with epoxy ensures proper curing. This structural parameter change achieves improved dielectric properties without requiring expensive alternative materials.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The composite achieves a low dielectric constant, high flame retardancy, and high heat resistance, meeting the requirements for high-frequency electronic materials while being environmentally friendly and maintaining the original properties of epoxy resin.
Implementation Method 1
The novel low-dielectric phosphorus-containing polyester composite is prepared by condensation under certain conditions of (A) a poly-functional phosphorus-containing aromatic hydroxy compound; (B) a difunctional aromatic acyl chloride compound; and (C) a monofunctional aromatic phenol compound
Implementation Method 2
The phosphorus-containing polyester composite is reacted with the epoxy group of the epoxy to obtain non-halogen and flame-retardant cured composite
Implementation Method 3
the cured composite has a high crosslinking density, such that even when the ester bond at the crosslinking point is hydrolyzed, lower-molecular-weight carboxylic acid is not free, and the cured composite also shows a low dielectric loss factor under high moisture
Data Source
AI summary
A phosphorus-containing polyester composite and method of manufacturing the same is related to the field of compound formulation. The composite is prepared by condensation under certain conditions of (A) a poly-functional phosphorus-containing aromatic hydroxy compound; (B) a difunctional aromatic acryl chloride compound and (C) a monofunctional aromatic phenol compound used as a blocking agent. The composite is used as a curing agent for epoxy. The phosphorus-containing polyester composite is reacted with the epoxy group of the epoxy to obtain non-halogen and flame-retardant cured composite being environment friendly and having low dielectric, low dielectric loss factor and high heat resistance. It can be used in an integrated circuit board and used as a semiconductor packaging material.