Phosphorus-Containing Polyphenylene Oxide Resin for Copper Clad Laminates
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Solution Overview
Problem
Current polyphenylene oxide resins used in copper clad laminates lack sufficient flame retardance and thermal resistance while maintaining low dielectric constant and dissipation factor requirements, and exhibit high thermal expansion.
Innovation Solution
A phosphorus-containing polyphenylene oxide resin with specific chemical structures and a method for its preparation, involving reactions with di(chloromethyl) compounds and phosphorus-containing compounds, is developed to enhance flame retardance and thermal resistance while maintaining excellent dielectric properties.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a phosphorus-containing flame retardant is added to polyphenylene oxide resin composition, then flame retardance is improved, but dielectric properties deteriorate and thermal resistance is reduced
Solution Approach 1:
The patent combines the polyphenylene oxide resin and phosphorus-containing flame retardant into a single integrated resin composition system, where the flame retardant is chemically incorporated into the polymer matrix rather than merely physically mixed, achieving synergistic effects that improve flame retardance while maintaining dielectric properties
Solution Approach 2:
The invention creates a composite resin material consisting of polyphenylene oxide resin and phosphorus-containing flame retardant in specific proportions (5-50 wt% phosphorus content), forming a new material system with combined properties that overcome the limitations of individual components
2Reliability
If a phosphorus-containing flame retardant is added to polyphenylene oxide resin composition, then flame retardance is improved, but thermal resistance is reduced
Solution Approach 1:
The patent optimizes the phosphorus content parameter within a specific range (5-50 wt%) to achieve the desired balance between flame retardance and thermal resistance, demonstrating that precise parameter control can resolve the contradiction between these two properties
3Object-generated harmful factors
If current polyphenylene oxide resin is used in copper clad laminate, then dielectric properties are maintained, but flame retardance and thermal resistance are insufficient
Solution Approach 1:
The patent introduces local quality enhancement by incorporating phosphorus-containing compounds specifically into the resin composition to provide flame retardance in critical areas, while the overall resin structure maintains its low dielectric constant and dissipation factor properties
4Object-generated harmful factors
If current polyphenylene oxide resin is used in copper clad laminate, then dielectric properties are maintained, but thermal expansion is excessively high
Solution Approach 1:
The invention creates a composite resin material that combines polyphenylene oxide with phosphorus-containing compounds, resulting in a material system that exhibits reduced thermal expansion compared to conventional polyphenylene oxide, while maintaining excellent dielectric properties
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The phosphorus-containing polyphenylene oxide resin achieves improved flame retardance, thermal resistance, and reduced thermal expansion, meeting the requirements for high-speed and high-frequency electronic applications with maintained dielectric properties.
Implementation Method 1
the flame retardance and thermal resistance of current polyphenylene oxide (such as dihydroxyl polyphenylene oxide or bis(vinylbenzyl) polyphenylene oxide) are insufficient
Implementation Method 2
Low dielectric resin materials are thus the main developing direction for current high frequency and high transmission rate laminates, so as to satisfy the requirement of high speed information transmission
Implementation Method 3
A phosphorus-containing polyphenylene oxide resin with specific chemical structures and a method for its preparation, involving reactions with di(chloromethyl) compounds and phosphorus-containing compounds
Data Source
AI summary
The present invention relates to a phosphorus-containing polyphenylene oxide resin, its preparation method, a method for preparing the prepolymer of the phosphorus-containing polyphenylene oxide, a resin composition and an article thereof, wherein the phosphorus-containing polyphenylene oxide resin has a chemical structure represented by the following formula (I):wherein R′ isR″ isR′″ is hydrogen,Through the use of the above phosphorus-containing polyphenylene oxide resin, an article made from the resin composition can has good flame retardance, good thermal resistance and a lower percent of thermal expansion while dielectric properties can be maintained, such that the present invention is suitable for use in products such as copper clad laminate and printed circuit board.