Phosphorus-Containing Silane for PCB Thermal Expansion
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional materials for electronic components face challenges in achieving low thermal expansion ratios without compromising properties like copper foil peeling strength, dielectric properties, and flame retardancy, particularly due to issues with branch-like patterns and inner resin flow in insulation materials.
Innovation Solution
A phosphorus-containing silane compound with a specific structure is synthesized by reacting phenyltrivinylsilane with 9,10-dihydro-9-oxa-10-phosphaphenanthrene-10-oxide or diphenylphosphine oxide, which is incorporated into a resin composition to enhance thermal expansion, adhesion, and flame retardancy, while preventing branch-like patterns and improving resin flow.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If conventional flame retardant materials are used in insulation material to provide flame retardancy, then flame retardancy is improved, but branch-like pattern appears at laminate edges and inner resin flow decreases
Solution Approach 1:
The patent changes the chemical parameters of the flame retardant by using phosphorus-containing silane compounds with specific molecular structures (Formulae III-VI) instead of conventional flame retardants. This parameter change in chemical composition eliminates the branch-like pattern defect while maintaining flame retardancy.
Solution Approach 2:
The patent creates a composite resin composition combining phosphorus-containing silane compound, vinyl-containing resin, and optional inorganic fillers. This composite material approach achieves both flame retardancy and good processing properties (no branch-like pattern, adequate resin flow) that conventional single materials cannot achieve.
2Stability of the object's composition
If phosphorus-containing silane compound is used to reduce thermal expansion ratio, then Z-axis thermal expansion is improved, but copper foil peeling strength may deteriorate
Solution Approach 1:
The patent optimizes the chemical structure parameters of the phosphorus-containing silane compound (specific Formulae III-VI with phenyl, vinyl, and phosphorus groups) to achieve low thermal expansion while the vinyl groups provide crosslinking capability that maintains or improves adhesion strength to copper foil.
Solution Approach 2:
The composite resin composition combines phosphorus-containing silane (for low thermal expansion) with vinyl-containing resin (for adhesion). The synergistic effect of this composite material achieves both low Z-axis thermal expansion ratio and adequate copper foil peeling strength, resolving the contradiction between these two properties.
3Strength
If conventional materials are used to ensure sufficient adhesion strength, then copper foil peeling strength is maintained, but thermal expansion ratio increases
Solution Approach 1:
The patent fundamentally changes the material composition by introducing phosphorus-containing silane compounds with specific structures (Formulae III-VI) that inherently provide both low thermal expansion and adhesion through vinyl group crosslinking, replacing conventional high-expansion materials.
Solution Approach 2:
The patent develops a composite resin system combining phosphorus-containing silane compound and vinyl-containing resin that achieves synergistic effects: the phosphorus-containing silane provides low thermal expansion while the vinyl groups enable crosslinking for strong adhesion, simultaneously improving both properties rather than trading one for the other.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The phosphorus-containing silane compound effectively reduces the Z-axis thermal expansion ratio, increases copper foil peeling strength, improves inner resin flow, and maintains excellent dielectric properties, achieving V-0 flame retardancy without degrading other material properties.
Implementation Method 1
reacting phenyltrivinylsilane with 9,10-dihydro-9-oxa-10-phosphaphenanthrene-10-oxide or diphenylphosphine oxide at a temperature of 160° C. to 200° C.
Data Source
AI summary
A phosphorus-containing silane compound has a structure of SiR1(R2)n(R3)3-n, wherein R1 is a phenyl group, R2 is a vinyl group, R3 each independently is a structure of Formula (I) or Formula (II), and n is 1 or 2. Moreover, a method of making the phosphorus-containing silane compound, a resin composition including the phosphorus-containing silane compound and a resin additive and an article made from the resin composition are described. The article includes a prepreg, a resin film, a laminate or a printed circuit board, wherein one or more properties including Z-axis ratio of thermal expansion, copper foil peeling strength, inner resin flow, branch-like pattern, dielectric constant, dissipation factor and flame retardancy may be improved.