Photo-curable Polyimide Resin Composition for Semiconductor Protective Films
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Solution Overview
Problem
Existing polyimide photoresist materials face challenges in achieving high film thickness, resolution, and maintaining desired properties due to high post-curing temperatures and sensitivity to oxygen, which limits their application in protective films for semiconductor chips and printed circuit boards.
Innovation Solution
A photo-curable resin composition comprising a polyimide with primary alcoholic groups, a condensate of amino compounds, and a photoacid generator, capable of generating acid upon irradiation, allowing for the formation of thick films with improved heat resistance and insulating properties at lower temperatures.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If photosensitive polyimide compositions using (meth)acrylic groups are used to lower post-curing temperature, then curing temperature is reduced, but the resin is easily damaged by oxygen or causes film reduction during development
Solution Approach 1:
The invention changes the chemical structure of the polyimide by introducing primary alcoholic groups at specific positions (2-position of benzene ring in diamine component). This structural modification enables the polyimide to undergo photo-curing reaction without using (meth)acrylic groups, thereby avoiding oxygen sensitivity and film reduction while maintaining low curing temperature capability
Solution Approach 2:
The invention creates a composite photo-curable system by combining polyimide with primary alcoholic groups and phenolic hydroxyl groups with diazonaphthoquinone. This composite approach enables effective photo-curing at lower temperatures while maintaining film integrity and resistance to oxygen damage
2Volume of moving object
If polyimide photoresist materials are used to achieve high film thickness, then film thickness is increased, but resolution and desired properties deteriorate
Solution Approach 1:
The invention modifies the polyimide molecular structure by introducing primary alcoholic groups that enable photo-curing functionality. This allows the formation of thick films with excellent pattern definition because the photo-curing mechanism operates effectively throughout the film thickness without compromising resolution
3Reliability
If high post-curing temperature is applied to obtain envisaged polyimide film, then film properties are improved, but base substrate selection is constrained and copper wiring oxidation occurs
Solution Approach 1:
The invention changes the curing mechanism from thermal imidization to photo-curing by incorporating primary alcoholic groups in the polyimide structure. This enables film formation and patterning at lower temperatures (below 300°C), eliminating copper wiring oxidation and expanding substrate compatibility while maintaining film quality
Solution Approach 2:
The invention replaces the thermal curing mechanism with a photo-curing mechanism. By using light irradiation instead of high temperature heating, the process avoids thermal damage to substrates and copper wiring while achieving the desired film properties and cross-linking
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The composition enables the formation of films with high resolution and excellent adhesion and insulating properties, suitable for protective films in electronic and semiconductor applications, without the limitations of oxygen sensitivity and high temperature requirements.
Implementation Method 1
a photoacid generator capable of generating acid upon irradiation with light of a wavelength of from 240 nm to 500 nm
Data Source
AI summary
The present invention relates to a photocurable resin composition, wherein the composition comprises:(A) a polyimide resin having one or more primary alcoholic groups with an alcoholic equivalent equal to or less than 3500, said polyimide being soluble in an organic solvent and having a weight average molecular weight of from 5,000 to 500,000; (B) at least one selected from the group consisting of a condensate of an amino compound modified with formalin, optionally further with alcohol, preferably a melamine resin modified with formalin, optionally further with alcohol, and a urea resin with formalin, optionally further with alcohol, and a phenolic compound having, on average, at least two selected from the group consisting of a methylol group and an alkoxy methylol group, and (C) a photoacid generator capable of generating an acid upon irradiation with light of a wavelength of from 240 nm to 500 nm.