Photo-curable Resin Composition for Thick Fine Patterning
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Solution Overview
Problem
Current photo-curable resin compositions face limitations in forming thick and uniform films on substrates with fine concavities and convexities, particularly exceeding 30 µm thickness, and suffer from planarity and step coverage issues due to increased viscosity and substrate unevenness, which are not adequately addressed by existing coating methods like spin coating and spray coating.
Innovation Solution
A photo-curable resin composition comprising a silicone polymer compound with epoxy and phenolic hydroxyl groups, a photosensitive acid generator, and specific crosslinking agents, which allows for thick and fine patterning by optimizing the mole ratio of epoxy to phenolic hydroxyl groups and incorporating compounds that enhance adhesiveness and chemical resistance, enabling films of 100 µm to 300 µm thickness with improved mechanical and electrical properties.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Length of stationary object
If spin coating method is used to form thick films, then film thickness can be increased, but viscosity increases and coating uniformity deteriorates
Solution Approach 1:
The patent modifies the chemical composition parameters of the photo-curable resin, specifically incorporating silicone polymer compounds with controlled molecular weights (3,000-500,000) and specific functional group ratios (epoxy to phenolic hydroxyl groups between 0.05-0.95). These parameter changes enable the resin to maintain appropriate viscosity for spin coating while achieving thick film formation capability
Solution Approach 2:
The patent creates a composite photo-curable resin system combining multiple components: silicone polymer compounds (with specific formulas (1) and (2)), phenolic resins, and crosslinking agents. This composite material approach allows the resin to exhibit both good flow characteristics for uniform coating and thick film formation capability simultaneously
2Manufacturing precision
If spray coating method is used to improve coating on uneven substrates, then coverage can be improved, but defects such as pinholes and height differences increase
Solution Approach 1:
The patent adjusts the viscosity and surface tension parameters of the photo-curable resin through specific compositional design, enabling the resin to naturally level on uneven substrates during spin coating without creating pinholes or height differences, thus achieving good step coverage through parameter optimization rather than alternative coating methods
3Length of stationary object
If photo-curable resin composition is used for thick films exceeding 100 µm, then film thickness can be increased, but pattern resolution and uniformity deteriorate
Solution Approach 1:
The patent optimizes the molecular weight parameters of the silicone polymer compound (3,000-500,000) and the ratio of functional groups to achieve the right balance between film thickness capability and pattern resolution. The controlled polymer chain length and functional group density enable light penetration and chemical amplification to work effectively even in thick films
Solution Approach 2:
The patent employs a chemically amplified negative resist mechanism where photo-acid generators catalyze crosslinking reactions upon light exposure. This chemical amplification process substitutes for purely physical coating mechanisms, enabling fine pattern formation in thick films through chemical control rather than relying solely on physical film properties
4Reliability
If epoxy group ratio is increased to improve adhesiveness, then chemical resistance improves, but viscosity increases and coating difficulty worsens
Solution Approach 1:
The patent precisely controls the epoxy to phenolic hydroxyl group ratio parameter within 0.05-0.95 to balance adhesiveness and processability. This parameter optimization ensures sufficient crosslinking density for chemical resistance while maintaining viscosity levels appropriate for spin coating operations
Solution Approach 2:
The patent introduces phenolic hydroxyl groups as a complementary functional group to epoxy groups. This local quality adjustment creates a balanced functional group distribution where epoxy groups provide adhesiveness and crosslinking, while phenolic hydroxyl groups contribute to flow characteristics and reduce viscosity, achieving both good adhesiveness and coating processability
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The composition facilitates the formation of thick and fine patterns with excellent adhesiveness, mechanical characteristics, and chemical resistance, suitable for protecting electronic parts and substrates, while reducing sensitivity changes and environmental dependencies, thus addressing the limitations of existing technologies.
Implementation Method 1
a photo-curable resin composition, comprising: (A) a silicone polymer compound having an epoxy group-containing repeating unit shown by the following general formula (1) and a phenolic hydroxyl group-containing repeating unit shown by the following general formula (2)
Data Source
AI summary
The present invention is a photo-curable resin composition containing (A) a silicone polymer compound having repeating units shown by the formulae (1) and (2), (B) a photosensitive acid generator capable of generating an acid by decomposition with light having a wavelength of 190 to 500 nm, (C) one or more compounds selected from an amino condensate modified with formaldehyde or formaldehyde-alcohol, a phenol compound having on average two or more methylol groups or alkoxymethylol groups per molecule, and a polyhydric phenol compound whose phenolic hydroxyl group is substituted with a glycidoxy group, and (D) one or more compounds selected from polyhydric phenols having 3 or more hydroxyl groups. As a result, there is provided a photo-curable resin composition that can facilitate thick and fine patterning when the composition is used in patterning.