Photo-Cured Material Pattern Transfer via Condensable Gas Atmosphere
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Solution Overview
Problem
The photo nanoimprint technique faces challenges in precisely transferring a convexo-concave pattern from a mold to a resist film due to air bubbles trapped between the mold and the resist film, leading to surface roughness issues in the resulting photo-cured material.
Innovation Solution
A method involving the use of a photo-curable composition with a gas dissolution inhibitor, applied in an atmosphere of condensable gas that condenses under specific temperature and pressure conditions, allowing the composition to fill gaps without trapping air bubbles, thereby improving pattern transfer precision and reducing surface roughness.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If the mold is brought into contact with the resist film in the atmosphere when transferring the pattern, then the pattern transfer can be performed, but air bubbles are trapped between the mold and resist film causing imprecise transfer
Solution Approach 1:
The patent applies an inert atmosphere (nitrogen or carbon dioxide) during the contact between mold and resist film to prevent air bubble formation. The atmosphere is maintained at a pressure of 100 to 1000 hPa, which suppresses air intrusion into gaps between the base member and mold, thereby eliminating air bubbles and enabling precise pattern transfer.
Solution Approach 2:
The patent changes the atmospheric pressure parameter to 100 to 1000 hPa during the contact step. This pressure adjustment prevents air from intruding into gaps while allowing the photo-curable composition to fill the gaps properly, thus preventing air bubble formation and improving pattern transfer precision.
2Manufacturing precision
If condensable gas is used to prevent air bubbles, then pattern transfer precision is improved, but nano-scale surface roughness is generated on the photo cured film
Solution Approach 1:
The patent uses inert gases (nitrogen or carbon dioxide) instead of condensable gases. These gases do not condense under the contact conditions, thereby preventing both air bubble formation and surface roughness. The inert atmosphere maintains a pressure of 100 to 1000 hPa to suppress air intrusion while avoiding the condensation issues that cause surface defects.
Solution Approach 2:
The patent adjusts the pressure parameter to 100 to 1000 hPa, which is sufficient to prevent air bubble formation but does not cause gas condensation. This pressure range optimizes both pattern transfer precision and surface smoothness by preventing air intrusion without introducing condensable gas-related surface roughness.
3Manufacturing precision
If photo-curable composition is applied to fill gaps between base member and mold, then pattern transfer is enabled, but air bubbles are trapped in the process
Solution Approach 1:
The patent applies an inert atmosphere during the photo-curable composition application and contact steps. This inert environment prevents air from being trapped in gaps between the base member and mold, allowing the photo-curable composition to fill gaps uniformly without air bubble formation, thereby enabling precise pattern transfer.
Solution Approach 2:
The patent maintains atmospheric pressure at 100 to 1000 hPa during the composition application and contact steps. This pressure parameter prevents air intrusion into gaps while allowing the photo-curable composition to properly fill the gaps, thus preventing air bubble formation and enabling accurate pattern transfer.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method enhances the precision of pattern transfer and results in a photo-cured material with reduced surface roughness, suitable for forming patterns at nano, micro, and milli-scales.
Implementation Method 1
an atmosphere of condensable gas that condenses under the conditions of a pressure and a temperature where a photo-curable composition making up the resist film intrudes gaps between a base member and the mold or concavities on the mold
Implementation Method 2
the resist is irradiated with light via the mold for curing, whereby the convexo-concave pattern of the mold is transferred to the resist film on the substrate
Data Source
Figure 1A~1G
Figure 2A~2B
AI summary
Provided is a method for manufacturing a photo cured material, by which transferring precision can be improved and a small surface roughness can be obtained. The method includes the steps of: placing a photo-curable composition on a substrate; brining a mold into contact with the photo-curable composition; irradiating the photo-curable composition with light; and releasing the mold from the photo-curable composition. The contact is performed in a condensable gas atmosphere, the condensable gas condensing under a temperature condition at the contact and under a pressure condition that the condensable gas receives when the photo-curable composition intrudes gaps between the substrate and the mold or concavities provided on the mold, and the photo-curable composition includes a gas dissolution inhibitor having a rate of weight change with reference to the condensable gas that is -1.0% to 3.0%.