Photo-imageable Substrate Conductive Posts for Flexible Microelectronics
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Solution Overview
Problem
Current methods for manufacturing microelectronic components with flexible dielectric substrates and conductive posts face limitations in achieving optimal alignment and connection efficiency, particularly in accommodating irregularities in circuit boards and requiring specialized test sockets.
Innovation Solution
A method involving an in-process unit with a metal layer and dielectric layer, where posts are formed by etching the metal layer, and the dielectric layer is selectively removed from the posts while remaining on the metal surface, allowing the posts to project from the traces, enabling independent movement and improved connection reliability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a flexible dielectric substrate with conductive posts is used to accommodate circuit board irregularities, then connection reliability is improved, but manufacturing complexity increases due to the need for specialized test sockets and complex alignment processes
Solution Approach 1:
The patent extracts the dielectric material from around the conductive posts, creating posts that project freely from the substrate surface. This allows the posts to move independently to accommodate circuit board irregularities while simplifying the manufacturing process by eliminating the need for specialized test sockets and complex alignment procedures.
Solution Approach 2:
The patent creates a dynamic structure where the conductive posts can move independently relative to the substrate and support elements. This dynamic capability allows the posts to self-adjust to irregularities in the circuit board, maintaining reliable connections without requiring complex fixed alignment mechanisms or specialized test equipment.
2Manufacturing precision
If the dielectric layer is completely removed from posts, then alignment precision is improved, but structural support is reduced
Solution Approach 1:
The patent selectively removes the dielectric layer from the posts while retaining it in other areas, achieving precise alignment of the posts with the support elements and circuit board contact pads. This partial extraction maintains the structural support provided by the dielectric layer in regions where it is retained, while enabling precise alignment where the dielectric is removed.
Solution Approach 2:
The patent applies different dielectric layer configurations to different regions: the dielectric is removed from the posts to enable precise alignment and independent movement, while the dielectric is retained in other areas to provide structural support and insulation. This local differentiation optimizes both alignment precision and structural strength.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enhances the alignment and connection efficiency of microelectronic components, allowing them to engage contact pads on irregular circuit boards without specialized test sockets, facilitating high-frequency signal transmission and reducing manufacturing complexity.
Implementation Method 1
a photo-imageable dielectric layer is formed and selectively removed to expose the metal layer
Data Source
AI summary
Methods for making a microelectronic component including a plurality of conductive posts extending and projecting away from a flexible substrate, wherein at least some of the conductive posts are electrically connected to a plurality of traces exposed on the flexible substrate.