Photo Receiver Bonding Layout for Optical Stress Reduction
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Solution Overview
Problem
Existing photo receivers face stress-related issues due to excessive bonding areas between solder and metal layers, which can lead to increased stress and degradation of optical properties in the photo detector.
Innovation Solution
A photo receiver design where the solder pattern layer and metal pattern layer are located in a peripheral area, preventing molten solder from migrating to the central area and reducing the bonding area, thus minimizing stress on the photo detector.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If the solder pattern layer and metal pattern layer are located in a central area, then the bonding area is increased, but the stress on the photo detector increases and optical properties degrade
Solution Approach 1:
The patent relocates the bonding area from the central region to the peripheral region of the photo detector, utilizing the peripheral dimension. This spatial reconfiguration allows the solder pattern layer and metal pattern layer to be positioned at the edges, surrounding the central optical components without interfering with them, thus maintaining bonding area while reducing stress on the optical properties
Solution Approach 2:
The patent applies different functional qualities to different regions of the photo detector. The central area is optimized for optical performance with sensitive components, while the peripheral area is optimized for mechanical bonding with solder and metal pattern layers. This local differentiation allows each region to perform its specific function without compromising the other
2Reliability
If the solder pattern layer and metal pattern layer are located in a peripheral area, then the stress on the photo detector is reduced, but the bonding area is decreased
Solution Approach 1:
The patent utilizes the peripheral dimension of the photo detector structure to position bonding elements. By moving from a centralized bonding approach to a distributed peripheral bonding approach, the design maintains adequate bonding area while ensuring the central optical region remains stress-free
3Reliability
If the solder pattern layer and metal pattern layer are located in a peripheral area surrounding the central area, then molten solder migration to the central area is prevented, but the layout complexity increases
Solution Approach 1:
The patent segments the photo detector into distinct functional zones: a central area for optical components and a peripheral area for bonding components. This segmentation is achieved through separate pattern layers (solder pattern layer and metal pattern layer) that are spatially divided, preventing solder migration while maintaining manufacturing feasibility through clear zone differentiation
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design reduces the stress on the photo detector, minimizing the degradation of optical properties and maintaining the integrity of the variable optical attenuators and optical 90-degree hybrid devices.
Implementation Method 1
a solder pattern layer provided on the third main surface. The solder pattern layer is bonded to the metal pattern layer
Data Source
AI summary
A photo receiver includes a photo detector including a semiconductor substrate having a first main surface and a second main surface and a metal pattern layer provided on the second main surface; and a carrier including a supporting substrate having a third main surface facing the second main surface and a solder pattern layer provided on the third main surface. The solder pattern layer is bonded to the metal pattern layer. The first main surface is provided with a variable optical attenuator, an optical 90-degree hybrid device, and a plurality of photodiodes optically coupled to the variable optical attenuator via the optical 90-degree hybrid device. The solder pattern layer and the metal pattern layer are located in a peripheral area surrounding a central area where the variable optical attenuator and the optical 90-degree hybrid device are located when viewed in the normal direction of the first main surface.