Photo-Release Agent Composition for Clean Semiconductor Delamination

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Solution Overview

Problem

Existing release agent compositions for semiconductor substrates after light irradiation face challenges in achieving both releasability and cleanability, leading to contamination and reduced yield due to foreign matter adherence, which complicates cleaning and reuse of substrates.

Innovation Solution

A release agent composition containing specific compounds and polymers with a carbon content of 80% or less, formulated to form a release agent layer that provides releasability and cleanability across a wide range of light irradiation amounts, utilizing a structure represented by a specific formula and including a solvent.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of operation

If a release agent layer is used to facilitate release of the semiconductor substrate from the support substrate, then releasability is improved, but foreign matter adheres to the substrate surfaces making cleanability difficult

Engineering Contradiction:

ImprovereleasabilityVSAvoidcleanability

Core Design Contradiction:

Ease of operationVSEase of manufacture

Solution Approach 1:

The invention changes the chemical composition parameters of the release agent by using compounds with carbon content of 80% or less and specific molecular structures (formulas 1-4), which enables the release agent to be effectively removed by oxygen plasma treatment, thus improving cleanability while maintaining releasability

Inventive Principle:

Principle #35Parameter changes

Solution Approach 2:

The invention employs oxygen plasma treatment as a strong oxidizing method to remove foreign matter including release agent residues from the substrate surfaces. The oxygen plasma effectively oxidizes and removes the carbon-based release agent compounds without damaging the semiconductor substrate, thereby solving the cleanability problem

Inventive Principle:

Principle #38Strong oxidants (Accelerated oxidation)

2Productivity

If foreign matter remains on the semiconductor substrate after release, then yield decreases, but increasing cleaning aggressiveness may damage the substrate

Engineering Contradiction:

ImproveyieldVSAvoidsubstrate damage risk

Core Design Contradiction:

ProductivityVSObject-affected harmful factors

Solution Approach 1:

Oxygen plasma treatment provides a controlled strong oxidizing environment that selectively removes foreign matter including release agent residues without damaging the semiconductor substrate. The plasma treatment conditions can be precisely controlled to achieve complete cleaning while protecting the substrate

Inventive Principle:

Principle #38Strong oxidants (Accelerated oxidation)

Solution Approach 2:

The invention replaces mechanical or chemical cleaning methods with oxygen plasma treatment, which uses reactive oxygen species to chemically remove contaminants. This substitution provides a more precise and controllable cleaning process that avoids substrate damage while effectively removing foreign matter

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

3Adaptability or versatility

If the release agent layer is difficult to remove, then support substrate reuse becomes difficult, but using easier release agents may reduce releasability

Engineering Contradiction:

Improvesupport substrate reuseabilityVSAvoidreleasability

Core Design Contradiction:

Adaptability or versatilityVSEase of operation

Solution Approach 1:

The invention optimizes the molecular structure parameters of the release agent compounds (using specific formulas with carbon content ≤80%) to achieve the right balance: the compounds provide sufficient adhesion during processing but can be completely removed by oxygen plasma, enabling support substrate reuse without compromising releasability

Inventive Principle:

Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The composition ensures effective release and cleanability of semiconductor substrates, reducing contamination and enabling efficient reuse of support substrates by forming a release agent layer with balanced releasability and cleanability.

Implementation Method 1

a release agent layer which is altered by absorbing light having a wavelength of 190 nm to 600 nm emitted through the support

Methodology Applied

Scientific EffectPhotodecomposition: Photodissociation

Data Source

PatentUS20250388785A1Release agent composition for release by irradiation with light, laminate, and method for producing processed semiconductor substrate

Publication Date: 2025.12.25 NISSAN CHEM CORP

AI summary

A release agent composition contains at least one of a compound and a polymer having a structure represented by formula (1) and having a carbon content of 80% or less, and a solvent. In formula (1), R1 and R2 each independently represents a hydrogen atom, a cyano group, a phenyl group, an alkyl group having 1 to 13 carbon atoms, a halogen atom, —COOR11 (R11 represents a hydrogen atom or an alkyl group having 1 to 4 carbon atoms), or —COO—, R3 represents a methoxy group, an alkyl group having 1 to 13 carbon atoms, or a halogen atom, n1 represents an integer of 0 to 4, and n2 represents 0 or 1, provided that the sum of n1 and n2 is 4 or less, X1 represents an ether or an ester bond, X2 represents an ether or an ester bond, and * represents a bond.