Photocatalyst CMP Polishing Composition Without Separate Oxidizers
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Solution Overview
Problem
Conventional Chemical Mechanical Polishing (CMP) processes for semiconductor devices require separate addition and handling of oxidizing agents, which complicates operations and leads to stability issues due to their high reactivity, necessitating point-of-use addition and additional equipment modifications.
Innovation Solution
Incorporating an organic photocatalyst into the polishing composition that becomes reactive only upon irradiation, eliminating the need for separate oxidizing agents and allowing for a fully formulated composition that can be used directly, leveraging existing light sources in CMP machines to generate oxidizing species during the polishing process.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional oxidizing agents are used in CMP processes, then effective polishing performance is achieved, but operation complexity increases and stability deteriorates due to high reactivity requiring separate handling and point-of-use addition
Solution Approach 1:
The patent combines the oxidizing function into the polishing composition itself by incorporating an organic photocatalyst that generates oxidizing species in situ when exposed to light. This eliminates the need for separate oxidizing agents and their associated handling equipment, directly resolving the contradiction between stability and operational complexity
Solution Approach 2:
The organic photocatalyst acts as an intermediary that converts light energy into chemical oxidation capability. It remains stable in the dark but activates to produce oxidizing species during polishing, providing a stable yet effective solution that avoids the handling issues of conventional oxidizers
2Ease of manufacture
If conventional oxidizing agents are used in CMP processes, then polishing effectiveness is maintained, but additional equipment modifications and separate storage facilities are required
Solution Approach 1:
The oxidizing function is merged into the polishing composition through the photocatalyst, allowing complete formulation in advance without separate storage or addition equipment. This directly addresses the contradiction by simplifying both formulation and equipment requirements
Solution Approach 2:
The photocatalyst enables the polishing composition to generate its own oxidizing species in situ during polishing through light activation. This self-service capability eliminates the need for external oxidizing agent delivery systems and modifications to existing CMP equipment
3Productivity
If separate oxidizing agents are added at point-of-use, then polishing performance is achieved, but time loss increases due to separate purchase, storage, and addition operations
Solution Approach 1:
The oxidizing capability is prepared in advance by incorporating the stable photocatalyst into the polishing composition during manufacturing. This preliminary action eliminates the need for time-consuming point-of-use preparation and addition operations, directly improving productivity by reducing time loss
Solution Approach 2:
The photocatalyst provides continuous oxidizing action throughout the polishing process as long as light is present, eliminating interruptions for separate oxidizing agent addition. This ensures continuous useful action and maximizes polishing efficiency without time losses
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution stabilizes the polishing composition, simplifies handling and storage, reduces costs, and eliminates the need for additional equipment modifications, while maintaining effective polishing performance by activating the photocatalyst during the CMP operation.
Implementation Method 1
the photocatalyst is a non-reactive component until irradiated with photons within a wavelength range where the photocatalyst is photoexcited causing reactive intermediates to be formed in the aqueous polishing composition
Data Source
AI summary
This disclosure relates to polishing compositions containing at least one abrasive, at least one organic photocatalyst, and water.