Photocoupler with Bonding Layer for Compact Optical Coupling
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Solution Overview
Problem
Existing photocouplers face challenges in reducing size and enhancing optical coupling efficiency due to the large distance between the light emitting and receiving elements, leading to increased mounting area and potential operation errors in industrial and household applications.
Innovation Solution
A photocoupler design featuring a semiconductor light emitting element with a bonding layer that transmits light to a light receiving element, reducing the distance between the light emitting layer and the receiving surface, and using a support substrate that minimizes light absorption, allowing for a thinner and more efficient device with improved optical coupling efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of energy
If the distance between the light emitting element and the light receiving element is reduced, then the optical coupling efficiency is improved, but the manufacturing precision requirements increase
Solution Approach 1:
The patent merges the light emitting element and light receiving element into a single integrated structure where the light receiving surface is formed on the same substrate as the light emitting layer. This integration eliminates the need for separate mounting and reduces the distance between emission and reception points, thereby improving optical coupling efficiency while maintaining manageable manufacturing precision through monolithic fabrication processes.
Solution Approach 2:
The patent introduces a transparent intermediate layer between the light emitting layer and the light receiving surface that serves as an optical waveguide. This intermediary structure facilitates efficient light transmission over the reduced distance while providing a buffer that relaxes the alignment precision requirements during manufacturing.
2Area of stationary object
If the photocoupler size is reduced, then the mounting surface area is decreased, but the optical coupling efficiency may deteriorate
Solution Approach 1:
The patent transitions from a planar side-by-side arrangement to a vertical stacked configuration where the light receiving surface is positioned directly above or below the light emitting layer. This dimensional change allows the optical coupling to occur over a short vertical distance while minimizing the horizontal mounting footprint, thereby achieving both compact size and high optical coupling efficiency.
Solution Approach 2:
The patent nests the light receiving surface within the same substrate structure that contains the light emitting layer, creating a compact integrated device. The light receiving element is positioned in close proximity to the light emitting element within the same package, eliminating the need for separate mounting areas and achieving space-efficient design without compromising optical coupling.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution achieves a high optical coupling efficiency, enabling a compact and reliable photocoupler that maintains insulation between input and output leads, suitable for various applications including industrial and household equipment.
Implementation Method 1
a light emitting layer (13) provided between the first layer (12) and the second layer (14)
Implementation Method 2
a bonding layer (34) which bonds the light emitting element (10) and the light receiving element (20}, and has transparency and insulating property
Implementation Method 3
receive light using a light receiving element, and then output an electrical signal
Data Source
AI summary
A photocoupler includes: a light emitting element; a light receiving element; and a bonding layer. The light emitting element includes a semiconductor stacked body, and a first and a second electrode. The semiconductor stacked body includes a light emitting layer. The light receiving element includes a first and a second electrode on a side of a light receiving surface. The bonding layer bonds the light emitting element and the light receiving surface, and has transparency and insulating property.