Photocoupler Package Layout for Higher Current in Less Resin
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Solution Overview
Problem
Semiconductor devices face challenges in downsizing due to the enlargement of resin packages with increasing current capacity, which affects the size and efficiency of components like photocouplers and switching elements.
Innovation Solution
The semiconductor device design includes a light-emitting element, a switching element, and a light-receiving element, where the switching element is positioned between the light-emitting and output-side leads, and a resin member that transmits light and seals the components, allowing for a reduced resin package size by optimizing the arrangement and connection of electrodes and conductive members.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Power
If the current capacity of the switching element is increased, then the current handling capability is improved, but the chip size and resin package size are enlarged
Solution Approach 1:
The patent transitions from a planar arrangement to a three-dimensional stacked configuration. The light-receiving element is positioned on top of the switching element, utilizing the vertical dimension (Z-axis) to accommodate additional components without increasing the footprint area. This dimensional change allows higher current capacity components to be integrated without proportionally increasing the resin package volume.
Solution Approach 2:
The patent implements a nested arrangement where the light-receiving element is placed directly on top of the switching element, and the resin member encloses both components within a single package structure. This nesting approach allows multiple functional elements to occupy overlapping spatial volumes, reducing the overall package size while maintaining the required current handling capability of the switching element.
2Volume of stationary object
If the resin package size is reduced, then the device compactness is improved, but the arrangement space for electrodes and conductive members is limited
Solution Approach 1:
The patent resolves electrode arrangement challenges by utilizing vertical stacking. The switching element has front-side and back-side electrodes arranged on opposite surfaces, allowing conductive paths to be established in the vertical dimension rather than requiring extensive lateral routing. This reduces the horizontal space needed for electrode connections while maintaining electrical functionality.
Solution Approach 2:
The patent divides the electrical connection function into separate segments: the switching element provides power transmission paths through its front-side and back-side electrodes, while the light-receiving element handles optical signal conversion. This segmentation allows each component to be optimized independently, with electrodes positioned only where needed, reducing overall package complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design enables a reduction in resin package size and height, improving the compactness and efficiency of semiconductor devices while maintaining the strength and functionality of the light-receiving element.
Implementation Method 1
the first resin member including a portion interposed between the light-emitting element and the light-receiving element; and the first resin member transmitting light radiated from the light-emitting element toward the light-receiving element
Data Source
AI summary
A semiconductor device includes an input-side lead, a light-emitting element on the input-side lead, an output-side lead, a switching element on the output-side lead, and a light-receiving element on the switching element. The switching element is provided between the light-emitting element and the output-side lead. The switching element includes a front-side electrode and a control pad arranged along a front surface side thereof. The light-receiving element is provided on the front-side electrode of the switching element via an insulative connection member. The light-receiving element is positioned between the first switching element and the light-emitting element. The light-receiving element includes first and second bonding pads; the first bonding pad is electrically connected to the control pad of the switching element via a first conductive member; and the second bonding pad is electrically connected to the front-side electrode of the switching element via a second conductive member.