Photocurable Adhesive Laser Curing Carbonization
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional photocurable adhesives face challenges in achieving sufficient curing, especially when thick, and are prone to carbonization when directly irradiated with laser light, making them unsuitable for applications replacing soldering or screw fixation.
Innovation Solution
A photocurable adhesive formulation incorporating an epoxy type adhesive component, a light absorption component with a thermal conductivity of at least 0.2 W/m·K before curing and 0.5 W/m·K after curing, and an inorganic filler, with a light absorption component content no more than 0.1 mass%, allowing for effective curing without surface carbonization.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Length of stationary object
If the thickness of the photocurable adhesive is increased, then the adhesive can be used for thicker bonds and replace soldering or screw fixation, but the inside of the adhesive becomes insufficiently cured and the surface carbonizes or burns off during laser irradiation
Solution Approach 1:
The patent changes the physical parameters of the adhesive by controlling the light absorption component content (0.01-0.1 mass%) and thermal conductivity (0.2-0.5 W/m·K) to enable thick adhesive layers to be cured uniformly by laser irradiation without surface carbonization, resolving the contradiction between adhesive thickness and curing sufficiency
Solution Approach 2:
The patent creates a composite adhesive system combining epoxy adhesive component, light absorption component, and inorganic filler to achieve specific thermal and optical properties that enable deep curing while preventing surface damage during laser processing
2Productivity
If direct irradiation with laser light is applied to the photocurable adhesive, then curing speed increases and the adhesive can replace soldering or screw fixation, but the surface of the adhesive carbonizes or burns off
Solution Approach 1:
The patent optimizes the light absorption component content to a narrow range (0.01-0.1 mass%) and controls thermal conductivity (0.2-0.5 W/m·K) to balance laser energy absorption for fast curing while preventing excessive heat concentration that causes surface carbonization
Solution Approach 2:
The patent converts the light absorption property, which could cause harmful surface carbonization, into a beneficial effect by precisely controlling the absorption component content to enable uniform energy distribution and thorough curing throughout the adhesive layer without surface damage
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The adhesive is sufficiently cured even at increased thicknesses and can be directly irradiated with laser light without significant surface carbonization, enabling its use as a substitute for soldering or screw fixation.
Implementation Method 1
a light absorption component which thermally cures the epoxy type adhesive component by absorption of the laser light
Implementation Method 2
a thermal conductivity before curing of the photocurable adhesive is no less than 0.2 W/m·K. The thermal conductivity after curing of the photocurable adhesive is no less than 0.5 W/m·K
Data Source
AI summary
Provided is a photocurable adhesive with which curing by direct irradiation of laser light is possible with almost no occurrence of surface carbonization and which is capable of satisfactory curing even when the coating thickness is increased. A photocurable adhesive, which is cured by irradiation of laser light, is provided. The curable adhesive contains an epoxy adhesive component, a light-absorbing component for thermal curing of the epoxy adhesive component by absorption of laser light, and an inorganic filler. The content of the light-absorbing component is 0.1 mass % or less. The pre-curing thermal conductivity of the photocurable adhesive is at least 0.2 W/m·K and the post-curing thermal conductivity is at least 0.5 W/m·K.