Photocurable Adhesive Composition for Fine Pattern Formation
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Solution Overview
Problem
Conventional adhesive patterns formed using thermosetting adhesives face challenges in achieving fine patterns and exhibit insufficient adhesiveness, hardness, and chemical resistance, particularly in photolithography methods for laminated structures in display devices and electronic components.
Innovation Solution
A photocurable and thermosetting adhesive composition comprising a carboxyl group-containing photosensitive prepolymer, epoxy resin, and photopolymerization initiator is used, allowing for the formation of a fine adhesive pattern through alkali-developing type photolithography, which provides strong adhesion and enhanced properties like hardness and chemical resistance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If a photolithography method is used to form adhesive patterns, then fine patterns can be formed, but the adhesiveness to substrates and laminating sheet members becomes insufficient
Solution Approach 1:
The patent uses a composite adhesive composition containing both a photocurable resin component and a thermosetting adhesive component. The photocurable resin enables photolithography patterning while the thermosetting adhesive provides strong adhesion to substrates and laminating sheet members, resolving the contradiction between fine pattern formation capability and adhesiveness.
Solution Approach 2:
The adhesive composition is designed to perform multiple functions simultaneously: it can be patterned via photolithography for fine structure formation, provides thermal curing for strong adhesion, and serves as both a bonding agent and a structural member. This multi-functionality resolves the contradiction by making a single material suitable for both precision patterning and reliable bonding.
2Ease of manufacture
If conventional photocurable adhesive compositions are used, then adhesive patterns can be formed, but the hardness, heat resistance, and chemical resistance of the cured product are insufficient
Solution Approach 1:
The patent combines a photocurable resin component (providing ease of pattern formation) with a thermosetting adhesive component (providing hardness, heat resistance, and chemical resistance). This composite material approach allows the cured product to exhibit both easy manufacturability through photolithography and superior mechanical and chemical properties.
Solution Approach 2:
The patent utilizes the different curing mechanisms and thermal properties of the two components: the photocurable component undergoes photo-induced polymerization for pattern formation, while the thermosetting component undergoes thermal curing to provide enhanced mechanical and chemical resistance. This parameter change approach allows optimization of both ease of manufacture and reliability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The adhesive composition enables the formation of highly effective adhesive patterns that provide strong adhesion and improved mechanical and chemical resistance, suitable for various laminated structures in display devices and electronic components, functioning both as an adhesive and structural member.
Implementation Method 1
a carboxyl group-containing photosensitive prepolymer (A) having both a carboxyl group and an ethylenically unsaturated bond in its molecule
Implementation Method 2
an epoxy resin (B)
Implementation Method 3
alkali-developing type photolithography
Data Source
AI summary
An adhesive pattern is formed by applying a photocurable and thermosetting adhesive comprising as indispensable ingredients (A) a carboxyl group-containing photosensitive prepolymer having both a carboxyl group and an ethylenically unsaturated bond in its molecule and an acid value in the range of 30 to 160 mg KOH/g, (B) an epoxy resin, and (C) a photopolymerization initiator onto a surface of a substrate as a member to be bonded to form a coating film; selectively exposing the coating film to an active energy ray through a photomask according to a predetermined pattern, thereafter removing an unexposed portion by development with an aqueous alkaline solution. Then, a sheet member as a joining member is pressed onto the adhesive pattern mentioned above, and the adhesive pattern is thermally cured to obtain a laminated structure.