Photocurable Bismaleimide Resin for Optical Waveguide Cladding
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Solution Overview
Problem
Existing resin compositions for redistribution layers in optical communication devices do not simultaneously consider optical properties such as refractive index in the near infrared and low dielectric properties required for recent high-frequency applications, limiting advanced integration and energy-saving optoelectronic integrated packaging.
Innovation Solution
A resin composition comprising a photocurable resin and a bismaleimide compound, specifically designed to provide a cladding function for polymer optical waveguides and low dielectric properties for redistribution layers, suitable for optoelectronic integrated packaging.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional resin compositions are used for redistribution layers, then electrical insulation is provided, but optical properties such as refractive index in the near infrared are not optimized
Solution Approach 1:
The patent develops a resin composition that simultaneously provides both electrical insulation properties and optimized optical properties (refractive index in near infrared). This multi-functional resin eliminates the need for separate insulating and optical waveguide materials, enabling integrated optoelectronic packaging where the same material serves dual purposes in redistribution layers and optical waveguide structures
Solution Approach 2:
The invention uses composite material formulation combining specific resin components to achieve both low dielectric properties for high-frequency electrical insulation and controlled refractive index for near-infrared optical transmission. This composite approach allows simultaneous optimization of electrical and optical characteristics that single materials cannot provide
2Productivity
If optical fibers of several tens of microns are used, then optical communication is achieved, but miniaturization to several microns to submicron units is required for high-density packaging
Solution Approach 1:
The patent enables miniaturization of optical waveguides from tens of microns to several microns or submicron units by controlling the refractive index of the resin material. This parameter change in waveguide dimensions, facilitated by the optimized resin composition, directly enables high-density packaging while maintaining optical communication functionality
Solution Approach 2:
The same resin composition serves as both the insulating material for redistribution layers and the cladding material for miniaturized optical waveguides. This multi-functionality simplifies the integration process for co-packaged optics, reducing device complexity despite the advanced miniaturization requirements
3Use of energy by moving object
If optoelectronic integrated packaging is implemented, then energy conservation is achieved, but advanced integration technology has not yet been established
Solution Approach 1:
The resin composition provides unified material solution for both electrical redistribution and optical waveguide structures, enabling co-packaged optics integration. This multi-functional material establishes the manufacturing foundation for optoelectronic integrated packaging, making energy-conserving implementations practically achievable
Solution Approach 2:
The composite resin formulation with optimized electrical and optical properties enables simultaneous fabrication of electrical and optical components in integrated packaging structures, advancing the ease of manufacture for optoelectronic integration while maintaining energy conservation benefits
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The composition achieves low dissipation factor and refractive index suitable for optical waveguides, enabling high-density packaging and energy-saving devices with improved insulation and optical communication capabilities.
Implementation Method 1
a photocurable resin and a bismaleimide compound
Data Source
AI summary
A purpose of the present invention is to provide a resin composition suitable for optical communication technologies. Another purpose is to provide a resin composition which can be used as the insulating resin of re-wiring layers for electronics and also as the clad resin of optical polymer waveguides and which is suitable for filling the gap between chips, chip boards, etc. in order to protect the wiring and to make it possible to produce highly integrated, energy-saving, multifunctional devices based on various package structures including co-packaged optics. The present inventors diligently made investigations and, as a result, have discovered that a composition comprising a photocurable resin and a bismaleimide compound is useful as a resin composition for optical waveguides, thereby completing the invention.