Photo-Curable Composition for Dry Etching and Thermal Stability
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Solution Overview
Problem
Photo-curable compositions used in nanoimprinting techniques lack sufficient dry etching resistance and thermal stability, which are essential for processing semiconductor devices and MEMS, where high yield and precision are required.
Innovation Solution
A photo-curable composition comprising a polymerizable compound, a photopolymerization initiator, and optional flame retarders or flame-retardant polymerizable compounds, which provides high dry etching resistance and thermal stability by incorporating components that enhance chemical stability and mechanical strength.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional photo-curable composition is used in nanoimprinting, then the composition can be easily cured and formed into patterns, but the composition lacks sufficient dry etching resistance and thermal stability
Solution Approach 1:
The patent uses composite materials by combining polymerizable compounds with specific functional groups (acrylate, methacrylate, vinyl) in defined weight ratios. This composite approach creates a cured film with enhanced dry etching resistance and thermal stability while maintaining ease of curing, directly resolving the contradiction between reliability and ease of manufacture
Solution Approach 2:
The patent applies parameter changes by precisely controlling the molecular weight, functional group types, and weight ratios of polymerizable compounds. By adjusting these parameters within specific ranges, the composition achieves optimal balance between dry etching resistance, thermal stability, and curability without complicating the manufacturing process
2Temperature
If conventional photo-curable composition is used, then the composition can be processed simply, but the thermal stability is insufficient due to heat of radical generating during dry etching
Solution Approach 1:
The patent employs composite materials comprising multiple polymerizable compounds with different functional groups (acrylate, methacrylate, vinyl) in specific proportions. This composite structure provides superior thermal stability to withstand dry etching heat while maintaining a relatively simple composition that can be processed without complex procedures
Solution Approach 2:
The patent applies local quality by selecting polymerizable compounds with specific functional groups that provide localized thermal stability properties. The acrylate, methacrylate, and vinyl groups contribute differently to thermal stability, creating a composition with enhanced local resistance to thermal degradation during dry etching
3Productivity
If high dry etching resistance is achieved through composition modification, then processing yield improves, but the composition complexity increases
Solution Approach 1:
The patent achieves high processing yield by optimizing parameters such as the weight ratios of polymerizable compounds (acrylate 20-80 wt%, methacrylate 10-60 wt%, vinyl 5-30 wt%) and their molecular weights. These parameter adjustments enhance dry etching resistance and improve productivity without significantly increasing composition formulation complexity
Solution Approach 2:
The patent uses parameter changes in the photopolymerization initiator content (1-20 wt% based on total polymerizable compounds) and irradiation conditions to achieve complete curing that maximizes processing yield. This approach improves productivity while keeping the composition formulation relatively simple and manageable
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The composition achieves improved dry etching resistance and thermal stability, enabling efficient processing of substrates with high precision and yield, particularly in semiconductor devices and MEMS applications.
Implementation Method 1
a photopolymerization initiator (B)
Implementation Method 2
a polymerizable compound (A) and a photopolymerization initiator (B)
Data Source
AI summary
An object is to provide a photo-curable composition having high dry etching resistance and high thermal stability. A photo-curable composition includes at least a polymerizable compound and a photopolymerization initiator, and further includes at least one of a flame retarder and a flame-retardant polymerizable compound.