Photocurable Composition for Low Shrinkage IAP Layers
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Solution Overview
Problem
Current inkjet adaptive planarization (IAP) materials lack high etch resistance, thermal stability, and exhibit significant thermal shrinkage during subsequent processing steps, which hinders the formation of suitable photo-cured layers for advanced substrate processing.
Innovation Solution
A photocurable composition comprising at least 75 wt% multi-functional acrylate monomer and 5 wt% mono-functional monomer with a ring parameter of at least 0.5, along with a photoinitiator, is used to form a photo-cured layer with high thermal stability and etch resistance, achieving a thermal shrinkage of not greater than 5% after baking at 250°C and a carbon content of at least 69%, optimized for use in IAP and NIL processes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional IAP materials are used, then the material can be applied and cured, but the photo-cured layer exhibits significant thermal shrinkage and low etch resistance
Solution Approach 1:
The patent changes the chemical composition parameters of the photocurable material by specifying exact weight percentages of different monomer types (multi-functional acrylate at least 75%, mono-functional at least 5%, and their specific combinations). This compositional parameter optimization resolves the contradiction by achieving both low thermal shrinkage (≤5%) and high etch resistance simultaneously, rather than accepting the poor performance of conventional materials.
Solution Approach 2:
The patent creates a composite photocurable composition by combining multiple types of monomers with specific functional properties: multi-functional acrylate monomers (for crosslinking density), mono-functional monomers (for flexibility and etch resistance), and specific additives. This composite approach allows the material to simultaneously achieve low thermal shrinkage and high etch resistance, resolving the technical contradiction between these two properties.
2Stability of the object's composition
If the photocurable composition uses high multi-functional acrylate monomer content for crosslinking, then thermal stability improves, but viscosity increases making jetting difficult
Solution Approach 1:
The patent optimizes the viscosity parameter by controlling the balance between multi-functional and mono-functional monomers, and by adjusting molecular weight and structural parameters of the monomers. The composition achieves viscosity ≤25 mPa·s at 23°C while maintaining high thermal stability through at least 75% multi-functional acrylate content, resolving the contradiction between thermal stability and ease of jetting operation.
Solution Approach 2:
The patent applies local quality by selecting specific monomer structures with particular properties (aromatic rings, cyclic structures with ring parameters ≥0.5) that provide thermal stability without excessively increasing viscosity. The mono-functional monomers with specific structural characteristics are used locally to modify the system's flow properties while maintaining crosslinking density for thermal stability.
3Reliability
If the photocurable composition achieves high carbon content for etch resistance, then etch resistance improves, but the material complexity and formulation difficulty increase
Solution Approach 1:
The patent simplifies the formulation process by establishing clear compositional parameters: at least 75% multi-functional acrylate monomer, at least 5% mono-functional monomer with ring parameter ≥0.5, and total carbon content ≥69%. These defined parameters provide a straightforward formulation guideline that achieves high etch resistance without excessive complexity, resolving the contradiction between performance and formulation simplicity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The composition effectively forms photo-cured layers with low viscosity, high thermal stability, and high etch resistance, enabling improved processing outcomes by minimizing thermal shrinkage and enhancing the durability of the planarized substrate layers.
Implementation Method 1
a photocurable composition can comprise a polymerizable material and a photoinitiator... irradiating the photocurable composition with light to form a photo-cured layer
Implementation Method 2
a photo-cured layer formed from the photocurable composition can have a thermal shrinkage after a baking treatment at 250° C. of not greater than 5.0%
Data Source
AI summary
A photocurable composition can comprise a polymerizable material and a photoinitiator, wherein the polymerizable material can comprise at least one multi-functional acrylate monomer in an amount of at least 75 wt % based on the total weight of the polymerizable material and at least one mono-functional monomer in an amount of at least 5 wt % based on the total weight of the polymerizable material. The at least one mono-functional monomer can have a ring parameter of at least 0.5, and a total carbon content of the photocurable composition after curing may be at least 69%. The photocurable composition may have a low thermal shrinkage after curing, a high etch resistance and be suitable for AIP or NIL processing.