Photocurable Composition Reducing Silicon Mold Swelling
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Solution Overview
Problem
Existing optical component molding techniques face challenges with thermoplastic resins lacking reflow resistance, acrylic resins producing imprecise molded articles, silicone resins requiring extra resin portions, and epoxy resins having shape accuracy and mold durability issues, especially with silicon molds experiencing resin-induced swelling.
Innovation Solution
A photocurable composition comprising cycloaliphatic epoxy, oxetane, and glycidyl ether epoxy compounds, along with a photoinitiator, is used with a silicon mold under ultraviolet irradiation, optimizing curability, shape transferability, and mold durability while minimizing resin-induced swelling.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If a silicon mold is used for UV imprint molding, then shape transferability and mold releasability are excellent, but the mold gradually swells by resin action with increasing use frequency and becomes unable to give cured articles with good accuracy
Solution Approach 1:
The patent changes the chemical composition parameters of the photocurable resin system by selecting specific epoxy compounds (cycloaliphatic epoxy with E-W value of 0.3 to 1.5 and oxetane compound with E-W value of 0.3 to 1.5) whose solubility parameters are matched to minimize interaction with the silicon mold. This parameter optimization reduces resin-induced swelling and maintains mold durability for repeated use while preserving shape transferability.
Solution Approach 2:
The patent uses a composite photocurable system combining multiple epoxy compounds and oxetane compounds with specific molecular weights and E-W values. This composite material approach creates a balanced resin system that achieves both excellent curability and minimal mold swelling, allowing the silicon mold to maintain its shape accuracy over multiple molding cycles.
2Reliability
If existing photocurable resins are used, then curability is achieved, but shape accuracy and mold durability are compromised
Solution Approach 1:
The patent optimizes the molecular weight parameters (Mc value of 0.03 to 0.3 and E-W value of 0.3 to 1.5) of the epoxy and oxetane compounds to achieve a balance between curability and shape accuracy. The specific parameter ranges ensure complete curing while maintaining dimensional precision and reducing mold interaction.
Solution Approach 2:
The patent applies different compound ratios locally optimized for specific performance requirements. The cycloaliphatic epoxy compound (5-50 wt%), oxetane compound (10-60 wt%), and glycidyl ether epoxy compound (5-50 wt%) are formulated in specific proportions to achieve localized properties that ensure both curability and shape accuracy in different regions of the cured article.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The composition achieves highly accurate, transparent, and heat-resistant optical components with improved mold durability and economic efficiency by reducing resin-induced swelling, enabling repeated use of silicon molds and enhanced productivity.
Implementation Method 1
a photocurable composition including a cycloaliphatic epoxy compound, an oxetane compound, a glycidyl ether epoxy compound, and a photoinitiator
Data Source
AI summary
Provided is a photocurable composition which less causes resin-induced swelling of molds, allows the molds to endure more satisfactorily, and has excellent economic efficiency. This photocurable composition includes components (A), (B), (C), and (D). The component (A) is present in a content of 10 to 50 weight percent of the totality of photocurable compounds contained in the photocurable composition. The component (A) is a cycloaliphatic epoxy compound represented by Formula (a). The component (B) is an oxetane compound having a solubility parameter of 9.5 (cal/cm3)1/2 or more as determined by the Fedors' method. The component (C) is a glycidyl ether epoxy compound having a molecular weight of 250 or more. The component (D) is a photoinitiator: wherein R1 to R18 are each, identically or differently, selected from hydrogen, halogen, a hydrocarbon group optionally containing oxygen or halogen, and optionally substituted alkoxy; and X is selected from a single bond and a linkage group.