Photocurable Encapsulation Composition for Moisture and Oxygen Blocking

The patent changes the dielectric constant parameter of the encapsulation material from high to low (2.8 or less), fundamentally altering the material property to eliminate polarization effects while maintaining protective function. This parameter change resolves the contradiction by selecting materials with low dielectric constants that do not cause polarization under external electric fields, thereby preserving touch sensitivity while still providing moisture and oxygen barrier protection.

The patent employs composite encapsulation structures combining organic and inorganic layers with specifically selected low-dielectric-constant materials. By composing the encapsulation layer from multiple materials with complementary properties (low dielectric constant, high barrier performance), the system achieves both moisture/oxygen blocking and maintained touch sensitivity, resolving the technical contradiction between protection and responsiveness.

The patent applies local quality by assigning specific functions to different layers: the organic layer provides flexibility and stress relief while the inorganic layer provides the primary barrier against moisture and oxygen. Each layer is optimized for its specific function rather than using uniform materials throughout, achieving effective protection while managing structural complexity through functional specialization.

The encapsulation structure is segmented into distinct organic and inorganic layers, each with specific compositions and functions. This segmentation allows independent optimization of each layer's properties (barrier performance, flexibility, dielectric constant) and simplifies the design process by breaking down the complex protection requirement into manageable functional segments that can be independently selected and combined.