Photocurable Flux Composition for Oxide-Safe Semiconductor Bonding
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Solution Overview
Problem
The challenge lies in developing a flux agent that can facilitate the manufacturing of small and multi-functional semiconductor devices while ensuring effective protection of conductive pads and connecting bumps during the bonding process, while also addressing the removal of metal oxides and impurities.
Innovation Solution
A flux agent comprising a first compound with an ester group and an epoxy group, a fourth compound as a chemical reactant of a second compound with an epoxy group and a third compound with an amine group and a carboxyl group, and a photoinitiator, with specific weight percentages, is used to form protective patterns that cover conductive pads and connecting bumps, facilitating bonding and protecting them from external impurities and metal oxides.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional flux agents are used, then the bonding process can proceed, but the protective patterns cannot effectively prevent metal oxide formation and impurity contamination simultaneously
Solution Approach 1:
The flux agent is applied to the conductive pads and connecting bumps before the bonding process to pre-form protective patterns. This preliminary action creates a protective barrier that prevents metal oxide formation and impurity contamination during subsequent manufacturing steps, ensuring reliable electrical connections without requiring additional protective layers.
Solution Approach 2:
The flux agent comprises a composite formulation including a first compound (60-95 wt%), a second compound (5-30 wt%), and a photoinitiator (2-10 wt%). This composite material structure provides both protective functionality and flux properties, enabling simultaneous protection against metal oxides and impurities while facilitating the bonding process.
2Object-affected harmful factors
If the flux agent composition is optimized for protection, then metal oxides are removed effectively, but the manufacturing process complexity increases
Solution Approach 1:
The flux agent uses specific weight percentage ranges for each component (first compound: 60-95 wt%, second compound: 5-30 wt%, photoinitiator: 2-10 wt%) to optimize metal oxide removal effectiveness. By controlling these compositional parameters, the formulation achieves effective protection without requiring overly complex manufacturing processes, as the compounds are mixed and applied using standard techniques.
Solution Approach 2:
The photoinitiator serves as an intermediary component that enables the formation of protective patterns through photopolymerization. This mediator allows the flux agent to transition from a simple liquid coating to a solid protective pattern upon UV irradiation, providing effective metal oxide removal and protection without adding significant manufacturing complexity.
3Reliability
If protective patterns are formed to cover conductive pads, then electrical connection reliability improves, but the manufacturing process time increases
Solution Approach 1:
The flux agent undergoes a phase transition from liquid to solid through photopolymerization when exposed to UV light. This phase transition allows the formation of solid protective patterns on the conductive pads and connecting bumps in a single rapid step, ensuring electrical connection reliability without requiring multiple processing steps or extended manufacturing time.
Solution Approach 2:
The patent replaces traditional thermal curing processes with photopolymerization initiated by UV light. This substitution eliminates the need for prolonged heating and allows for rapid formation of protective patterns, reducing manufacturing process time while maintaining electrical connection reliability through effective protection of conductive elements.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enables efficient formation of protective patterns that maintain the integrity of conductive pads and connecting bumps, allowing for reliable electrical connections and enhanced durability of semiconductor packages.
Implementation Method 1
a photoinitiator, wherein the content of the first compound is 60 wt % to 95 wt % based on 100 wt % of the total agent, the content of the fourth compound is 3 wt % to 33 wt % based on 100 wt % of the total agent, and the content of the photoinitiator is 2 wt % to 10 wt % based on 100 wt % of the total agent
Implementation Method 2
a fourth compound which is a chemical reactant of a second compound comprising an epoxy group and a third compound comprising an amine group and a carboxyl group
Data Source
AI summary
Provided is a flux agent according to embodiments of the inventive concept, wherein the flux agent includes a first compound including an ester group and an epoxy group, a fourth compound which is a chemical reactant of a second compound including an epoxy group and a third compound including an amine group and a carboxyl group, and a photoinitiator, wherein the content of the first compound is 50 wt % to 60 wt % based on 95 wt % of the total agent, the content of the fourth compound is 3 wt % to 33 wt % based on 100 wt % of the total agent, and the content of the photoinitiator is 2 wt % to 10 wt % based on 100 wt % of the total agent.