Photocurable Composition for Thermally Stable, Low-Shrinkage IAP Layers

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Solution Overview

Problem

Existing inkjet adaptive planarization (IAP) materials face challenges in achieving high thermal stability and low shrinkage during high-temperature processing, which is crucial for downstream integrated circuit fabrication steps.

Innovation Solution

A photocurable composition comprising a polymerizable material with at least 10 wt% multi-functional vinylbenzene monomer, a photoinitiator with an oxime ester compound, and a photoacid generator, which together enhance the thermal stability and reduce shrinkage of the cured layer.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If conventional IAP materials are used, then the material can be jetted and cured, but the thermal stability is insufficient and shrinkage is high during high-temperature processing

Engineering Contradiction:
Improvethermal stabilityVSAvoidshrinkage
Core Design Contradiction:
TemperatureVSManufacturing precision

Solution Approach 1:

The patent changes the chemical composition parameters of the polymerizable material by incorporating specific multi-functional monomers (vinylbenzene, vinylcyclohexene, vinylnaphthalene derivatives) and controlling the functional group density and molecular weight, which fundamentally alters the thermal properties and shrinkage behavior of the cured material

Inventive Principle:
Principle #35Parameter changes

Solution Approach 2:

The patent creates a composite photocurable system combining multiple photoinitiators (Type I and Type II), polymerizable monomers with different functional groups, and optional inorganic fillers, where each component contributes specific properties that collectively achieve high thermal stability and low shrinkage

Inventive Principle:
Principle #40Composite materials

2Temperature

If the composition is designed for high thermal stability, then thermal performance improves, but viscosity may increase affecting inkjet dispensing

Engineering Contradiction:
Improvethermal stabilityVSAvoidviscosity
Core Design Contradiction:
TemperatureVSEase of operation

Solution Approach 1:

The patent carefully controls the molecular weight and functional group density of the polymerizable monomers to achieve the right balance: low enough molecular weight to maintain low viscosity for inkjet dispensing, but sufficient functional group content to ensure high thermal stability after curing

Inventive Principle:
Principle #35Parameter changes

Solution Approach 2:

The patent uses multi-functional monomers that concentrate crosslinking activity at specific locations (creating a dense crosslinked network only where needed), allowing the bulk material to remain low-viscosity for easy dispensing while the cured structure achieves high thermal stability

Inventive Principle:
Principle #3Local quality

3Temperature

If multi-functional vinylbenzene monomer content is increased, then thermal stability and etch resistance improve, but the complexity of composition formulation increases

Engineering Contradiction:
Improvethermal stabilityVSAvoidcomposition formulation
Core Design Contradiction:
TemperatureVSDevice complexity

Solution Approach 1:

The patent optimizes the concentration of multi-functional vinylbenzene monomers to specific ranges (at least 10 wt% of polymerizable material) where the benefits of enhanced thermal stability and etch resistance are achieved without excessive formulation complexity

Inventive Principle:
Principle #35Parameter changes

Solution Approach 2:

The selected vinylbenzene monomers provide multiple benefits simultaneously: they contribute to thermal stability, improve etch resistance, enable adequate crosslinking density, and maintain compatibility with inkjet dispensing, reducing the need for additional specialized additives

Inventive Principle:
Principle #6Universality (Multi-functionality)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The composition achieves a TGA400 weight loss of not greater than 9% and linear shrinkage after baking at 400°C of not greater than 9.5%, making it suitable for high-temperature processing in integrated circuit fabrication.

Implementation Method 1

The flat liquid layer is typically solidified under UV light exposure

Methodology Applied
Scientific EffectPhotopolymerization: Photopolymerisation

Implementation Method 2

the excitation wavelength of the photoinitiator and the photoacid generator can be in a range of 350 nm to 400 nm

Methodology Applied
Scientific EffectPhotoabsorption: Absorption (EM radiation)

Implementation Method 3

the cured IAP resist has a high thermal stability and low shrinkage if exposed to high temperatures

Methodology Applied
Scientific EffectThermal shrinkage: Thermal Contraction

Data Source

PatentUS20250289916A1Photocurable composition
Publication Date: 2025.09.18 CANON KK
  • US20250289916A1 patent drawing
  • US20250289916A1 patent drawing
  • US20250289916A1 patent drawing

AI summary

A photocurable composition can comprise comprising a polymerizable material, a photoinitiator, and a photoacid generator, wherein the polymerizable material comprises at least one multi-functional vinylbenzene monomer in an amount of at least 10 wt % based on the total weight of the polymerizable material and the photoinitiator includes an oxime ester compound. The photocurable composition can be suitable for inkjet adaptive planarization (IAP) processing and the forming of photo-cured layers having a high thermal stability and low thermal shrinkage.