Photocurable Composition for Imprint Film Surface Roughness

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Solution Overview

Problem

Existing photo imprint technologies face challenges in achieving uniform resin pattern thickness and surface smoothness due to bubble formation during the curing process, which can lead to unintended shape distortions and impaired productivity.

Innovation Solution

A photocurable composition containing a (meth)acrylate monomer, a photopolymerization initiator, and a mold releasing agent with a saturated solubility of 5% or less in a condensable gas at 5°C and 1 atm is used, allowing for imprinting in an atmosphere with a condensable gas to reduce surface roughness and bubble formation.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Object-affected harmful factors

If a condensable gas is introduced between the mold and substrate to eliminate bubbles, then bubble removal is improved, but the surface of the resist becomes rough

Engineering Contradiction:

Improvebubble formationVSAvoidsurface roughness

Core Design Contradiction:

Object-affected harmful factorsVSManufacturing precision

Solution Approach 1:

The patent changes the chemical composition parameters of the photocurable composition by incorporating specific mold releasing agents and surfactants that modify the interaction between the condensable gas and the resist surface. This allows the system to tolerate the presence of condensable gas for bubble elimination while preventing surface roughening through chemical parameter optimization

Inventive Principle:

Principle #35Parameter changes

Solution Approach 2:

The patent introduces mold releasing agents and surfactants as intermediary substances that mediate between the condensable gas and the resist. These intermediaries prevent direct harmful interaction between the condensable gas and the resist surface, allowing bubble elimination to proceed without causing surface roughness

Inventive Principle:

Principle #24Intermediary (Mediator)

2Manufacturing precision

If the resist is applied in a discrete manner to optimize pattern density, then pattern transfer accuracy is improved, but bubble formation increases during pressing

Engineering Contradiction:

Improvepattern transfer accuracyVSAvoidbubble formation

Core Design Contradiction:

Manufacturing precisionVSObject-affected harmful factors

Solution Approach 1:

The patent uses mold releasing agents and surfactants as intermediary substances that prevent bubble formation at the interface between the discrete resist droplets and the mold. These intermediaries allow the discrete application method to maintain pattern transfer accuracy while eliminating the harmful bubble formation effect

Inventive Principle:

Principle #24Intermediary (Mediator)

3Manufacturing precision

If one waits for bubbles to disappear before curing, then resin pattern quality is improved, but productivity decreases

Engineering Contradiction:

Improveresin pattern qualityVSAvoidproduction speed

Core Design Contradiction:

Manufacturing precisionVSProductivity

Solution Approach 1:

The patent replaces the mechanical waiting process (allowing bubbles to naturally dissipate over time) with a chemical solution (mold releasing agents and surfactants) that prevents bubble formation and enables rapid elimination. This substitution allows immediate curing without quality loss, thereby maintaining productivity

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

Solution Approach 2:

The patent enables the process to skip the waiting period for bubble disappearance by using mold releasing agents and surfactants that prevent and rapidly eliminate bubbles. This allows the curing process to proceed immediately after mold contact, rushing through what would traditionally be a time-consuming waiting step

Inventive Principle:

Principle #21Skipping (Rushing through)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The approach results in a cured film with reduced surface roughness and improved uniformity, enhancing the quality of optical, circuit board, and electronic components by minimizing bubble-induced distortions and maintaining productivity.

Implementation Method 1

a component (B) which is a photopolymerization initiator

Methodology Applied

Scientific EffectPhotopolymerization: Photopolymerisation

Implementation Method 2

introducing a condensable gas, which becomes condensed under capillary pressure generated as the resist penetrates the gap between the substrate and the mold

Methodology Applied

Scientific EffectCondensation: Condensation

Implementation Method 3

capillary pressure generated as the resist penetrates the gap between the substrate and the mold

Methodology Applied

Scientific EffectCapillary pressure: Capillary Pressure

Implementation Method 4

a component (C) which is a mold releasing agent

Methodology Applied

Scientific EffectMold releasing: Lubrication

Data Source

PatentUS10456974B2Photocurable composition, methods for producing film, optical component, circuit board, and electronic component by using the same, and cured product

Publication Date: 2019.10.29 CANON KK

AI summary

An imprint method that uses a condensable gas process has a problem in that the surface of a resist cured film is rough. This is resolved by a photocurable composition used for performing imprint in an atmosphere containing a condensable gas. The photocurable composition contains a component (A) which is a (meth)acrylate monomer, a component (B) which is a photopolymerization initiator, and a component (C) which is a mold releasing agent. A saturated solubility of the component (C) in the condensable gas at 5 degrees (Celsius) and 1 atm is 5% by weight or less, the condensable gas being in a liquid state at 5 degrees (Celsius) and 1 atm.