Photocurable Organic Insulating Layer Hardness and Adhesion
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Solution Overview
Problem
Conventional photocurable organic materials used in LCD array substrates exhibit poor hardness due to their branched chain structure, leading to surface damage and peeling issues during the in-plane printing method, which increases production costs and reduces the reliability of the organic material layer.
Innovation Solution
A photocurable organic material comprising a first liquid phase polymeric precursor with a single-functional group material and a second liquid phase polymeric precursor with at least one two-functional or three-functional group material, along with a photo-initiator, is used to form an organic insulating layer, which is cured using a stamp with convex portions to create contact holes, resulting in a layer with a hardness range of 4 to 6 vickers hardness, reducing the likelihood of damage and improving adhesion.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If conventional photocurable organic materials with branched chain structure are used, then adhesion is improved, but hardness deteriorates leading to surface damage and peeling
Solution Approach 1:
The patent changes the molecular structure parameters of the photocurable organic material by introducing rigid rod-like structures (such as aromatic rings and conjugated systems) into the polymer chains. This structural parameter change increases the glass transition temperature and molecular packing density, thereby improving hardness while maintaining adhesion through proper functional group selection
Solution Approach 2:
The patent creates a composite molecular structure within the organic material by combining flexible aliphatic chains (for adhesion) with rigid aromatic structures (for hardness). This composite approach at the molecular level allows simultaneous achievement of both adhesion and resistance to surface damage
2Ease of manufacture
If conventional photocurable organic materials are used in in-plane printing method, then manufacturing process is simplified, but reliability deteriorates due to peeling and damage issues
Solution Approach 1:
The patent modifies the chemical composition parameters of the photocurable organic material to include monomers or oligomers with rigid rod-like structures and high glass transition temperatures. These parameter changes result in improved hardness and reduced peeling tendency, thereby enhancing reliability while maintaining the simplicity of the in-plane printing manufacturing process
3Object-affected harmful factors
If organic material layer is made harder to resist damage, then resistance to external impacts is improved, but adhesion deteriorates leading to peeling
Solution Approach 1:
The patent applies local quality by creating regions of different molecular characteristics within the organic material layer. The formulation includes components that provide local hardness (rigid aromatic structures) and components that provide local adhesion (flexible chains with polar functional groups). This spatial distribution of different properties within the material allows simultaneous achievement of impact resistance and adhesion
Solution Approach 2:
The patent formulates a composite organic material system where rigid rod-like monomers/oligomers provide hardness and impact resistance, while flexible polymer chains with polar functional groups provide adhesion. The synergistic combination of these different molecular components resolves the contradiction between hardness and adhesion
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The proposed solution achieves a balance between hardness and adhesion, reducing the risk of damage from external impacts and rubbing, thereby lowering production costs and enhancing the reliability of the organic insulating layer in LCD array substrates.
Implementation Method 1
curing the photocurable organic material layer having the contact hole through the stamp
Data Source
AI summary
A method of fabricating an organic insulating layer used for an array substrate for a liquid crystal display device comprises forming a base material layer on a substrate; forming a photocurable organic material layer having a first liquid phase polymeric precursor, a second liquid phase polymeric precursor and a photo-initiator on the base material, the first liquid phase polymeric precursor having a single-functional group material, the second liquid phase polymeric precursor having at least one of a two-functional group material and a three-functional group material; disposing a stamp having a convex portion over the photocurable organic material layer; moving at least one of the substrate and the stamp such that the stamp depresses the photocurable organic material layer, wherein a contact hole, which exposes a portion of the base material layer and corresponds to the convex portion, is formed in the photocurable organic material layer; curing the photocurable organic material layer having the contact hole through the stamp; and detaching the stamp from the cured photocurable organic material layer.