Photocurable Composition with Non-Reactive Polymer for Low-Shrinkage
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Solution Overview
Problem
Existing inkjet adaptive planarization (IAP) materials lack high etch resistance, high thermal stability, and low shrinkage during subsequent processing steps.
Innovation Solution
A photocurable composition comprising a polymerizable material, a non-reactive polymer with a carbon content of at least 80%, molecular weight between 750 g/mol and 20,000 g/mol, and a viscosity not exceeding 110 mPa·s, which includes a photoinitiator and optional additives, forming a photo-cured layer with low thermal shrinkage and high thermal stability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Stability of the object's composition
If conventional photocurable materials are used for IAP, then the process can be performed, but the photo-cured layers exhibit high thermal shrinkage and low thermal stability during subsequent processing
Solution Approach 1:
The patent changes the chemical composition parameters of the photocurable material by incorporating high carbon content polymers (≥80% carbon) with specific molecular weights (750-20,000 g/mol) and controlled viscosities (≤110 mPa·s). These parameter modifications result in photo-cured layers with linear shrinkage ≤6% and thermal decomposition temperatures ≥300°C, directly resolving the thermal stability and shrinkage contradiction.
Solution Approach 2:
The invention creates a composite photocurable composition containing polymerizable materials, high carbon content polymers, and photoinitiators. This composite structure combines the benefits of different materials to achieve both low thermal shrinkage and high thermal stability, overcoming the limitations of conventional single-material photocurable compositions.
2Reliability
If conventional photocurable materials are used, then the composition can be applied, but the photo-cured layers exhibit low etch resistance
Solution Approach 1:
The patent optimizes the viscosity parameter of the photocurable composition to ≤110 mPa·s (preferably ≤50 mPa·s) while incorporating high carbon content polymers. This parameter control ensures both good printability and jetting characteristics (ease of manufacture) and high etch resistance (reliability) of the cured layers, resolving the contradiction between these two properties.
3Stability of the object's composition
If high carbon content polymer is added to improve thermal stability, then thermal decomposition temperature increases, but viscosity of the composition increases
Solution Approach 1:
The patent carefully controls the molecular weight of the high carbon content polymer within the range of 750-20,000 g/mol and limits its content to 10-30 wt%. Simultaneously, the viscosity of the final composition is controlled to ≤110 mPa·s. This multi-parameter optimization allows achieving thermal decomposition temperatures ≥300°C while maintaining ease of operation and printability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The composition achieves a linear shrinkage of not greater than 6% and a thermal decomposition temperature of at least 300°C, enhancing etch resistance and thermal stability of the photo-cured layers.
Implementation Method 1
The flat liquid layer is typically solidified under UV light exposure
Implementation Method 2
the thermal decomposition temperature of the photocurable composition after photo-curing can be at least 300° C.
Data Source
AI summary
A photocurable composition can comprise a polymerizable material, at least one non-reactive polymer, and a photoinitiator, wherein the non-reactive polymer can have a carbon content of at least 80% based on the total weight of the non-reactive polymer; a molecular weight of the at least one non-reactive polymer can be at least 750 g/mol and not greater than 20,000 g/mol; an amount of the non-reactive polymer may be at least 10 wt % and not greater than 30 wt %; and a viscosity of the photocurable composition may be not greater than 110 mPa·s. The photocurable composition may have a low linear shrinkage after curing, a high carbon content and high etch resistance and being suitable for AIP or NIL processing.