Photocurable Resin Adhesion to Polypropylene

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Solution Overview

Problem

Conventional photocurable resin compositions, such as those containing diallyl phthalate resins, exhibit insufficient adhesion to plastic substrates like polypropylene (PP), which limits their application in ink and coating materials.

Innovation Solution

A photocurable resin composition comprising an allylic polymer produced by polymerization of a specific allylic compound and a tackifier resin, which provides excellent adhesion to plastic substrates, particularly polypropylene, through compatibility enhancement with similar polarities.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Productivity

If diallyl phthalate resins are used in photocurable resin compositions, then the composition can be cured quickly by light and is environmentally friendly, but the adhesion to plastic substrates (especially polypropylene) is insufficient

Engineering Contradiction:
Improvecure rateVSAvoidadhesion to plastic substrates
Core Design Contradiction:
ProductivityVSReliability

Solution Approach 1:

The patent uses a composite resin system combining diallyl phthalate resin with polyester resin and/or polyamide resin. This composite approach leverages the fast curing properties of diallyl phthalate while the polyester/polyamide components provide enhanced adhesion to plastic substrates, particularly polypropylene, thereby resolving the contradiction between cure rate and adhesion reliability.

Inventive Principle:
Principle #40Composite materials

Solution Approach 2:

The patent modifies the resin composition parameters by specifying precise weight ratio ranges (diallyl phthalate resin:polyester resin:polyamide resin = 100:5-50:5-50) and incorporating resins with specific molecular weight ranges and carboxyl groups. These parameter changes optimize both the curing speed and adhesion properties simultaneously.

Inventive Principle:
Principle #35Parameter changes

2Productivity

If conventional resin compositions are used to achieve fast curing, then productivity is improved, but compatibility with various plastic substrates is limited

Engineering Contradiction:
Improvecuring speedVSAvoidcompatibility with plastic substrates
Core Design Contradiction:
ProductivityVSAdaptability or versatility

Solution Approach 1:

The patent creates a universal resin composition that can adhere to multiple types of plastic substrates including polyethylene, polypropylene, and other olefin resins. The multi-functional resin system (combining diallyl phthalate, polyester, and polyamide resins) provides both fast curing capability and broad substrate compatibility, eliminating the need for substrate-specific formulations.

Inventive Principle:
Principle #6Universality (Multi-functionality)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The composition achieves superior adhesion and compatibility with polypropylene substrates, making it suitable for use in inks and coating materials where conventional diallyl phthalate resin compositions struggle to adhere effectively.

Implementation Method 1

active energy ray-curable ink compositions each containing a photopolymerizable acrylate monomer

Methodology Applied
Scientific EffectPhotopolymerization: Photopolymerisation

Data Source

PatentEP3211015B1Photocurable resin composition, ink, and coating
Publication Date: 2024.08.07 OSAKA SODA CO LTD
  • EP3211015B1 patent drawing
  • EP3211015B1 patent drawing
  • EP3211015B1 patent drawing

AI summary

An abject of the present invention is to provide a photocurable resin composition that has excellent adhesion to plastic substrates and can form a composition with good compatibility. The present invention relates to a photocurable resin composition containing: an allylic polymer (A) produced by polymerization of an allylic compound represented by the formula (I) below; and a tackifier resin (B),